Adhesion Property of Novel Polyimides Containing Fluorine and Phosphine Oxide Moieties
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Adhesion Property of Novel Polyimides Containing Fluorine and Phosphine Oxide Moieties K. U. Jeong, Y. J. Jo, H. M. Knag and T. H. Yoon Department of Materials Science and Engineering Kwangju Institute of Science and Technology 1 Oryong-dong, Buk-gu, Kwangju, 500-712 Korea
ABSTRACT Novel diamine monomers, containing fluorine and phosphine oxide - bis(3-aminophenyl)-3,5bis(trifluoromethyl)phenyl phosphine oxide (mDA6FPPO) and bis(3-aminophenyl)-4(trifluoromethyl)phenyl phosphine oxide (mDA3PPO) - were utilized to prepare polyimides with dianhydrides such as 6FDA, BTDA or ODPA by the conventional two-step route, i.e., preparation of poly(amic-acid), followed by solution imidization. Adhesion property of the polyimides was evaluated via a peel test with bare Cu foil, as well as Cr/silane coated Cu foils, and failure surfaces were analyzed by SEM/EDX to elucidate the adhesion mechanism. The polyimides with 3FDAm exhibited the highest Tg, followed by mDAPPO-, mDA3FPPO- and mDA6FPPO-based polyimides, but the mDAPPO-based polyimides exhibited the highest adhesion properties, followed by mDA3FPPO, mDA6FPPO, mDDS and 3FDAm, attributing to phosphine oxide and fluorine moieties.
INTRODUCTION Aromatic polyimides have been widely utilized in electronic packaging applications due to their excellent dielectric properties, adhesion and mechanical properties, thermal and chemical resistance, and dimensional stability[1]. Among these, low dielectric constant is one of the decisive factors in minimizing electrical power loss and delay in signal transmission in thin film insulators[2], thus providing better performance of electronic devices. Therefore, there has been a great deal of research to improve the dielectric properties via fluorination[3-5] and nano-foam technology[6], and more recently, the utilization of organic-inorganic hybrid nano-composites and poly(silsesquioxane)[7]. Among them, fluorinated polyimides are known to have low dielectric constant, low water up-take, low reflective index and excellent solubility even in chloroform, toluene or tetrachloroethane (TCE)[4]. However, they also have drawbacks such as poor adhesion, low mechanical strength and high coefficient of thermal expansion (CTE)[2,8-9]. Since the adhesion property polyimides is one of the critical factors in microelectronic applications, there has been a great amount of research on the adhesion properties of fluorinated polyimides. Recently, McGrath and co-workers have reported that the incorporation of phosphine oxide moiety greatly enhanced the adhesion properties of polyimides[10] with the added benefit of excellent miscibility owing to strong hydrogen bonding[11].
In this study, therefore, monomers containing phosphine oxide and fluorine moieties were utilized to prepare polyimides having enhanced adhesion properties as well as a low dielectric constant. Bis(3-aminophenyl)-3,5-bis(trifluoromethyl)phenyl phosphine oxide (mDA6FPPO) and bis(3-aminophenyl)-4-(trifluoromethyl)phenyl phosphine oxide (mDA3PPO) were utilized to
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prepare pol
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