Amorphous Ta-N as a Diffusion Barrier for Cu Metallization

PDF / 254,896 Bytes
6 Pages / 432 x 648 pts Page_size
77 Downloads / 275 Views

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Șȯȯ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

Data Loading...

Amorphous Ta-N as a Diffusion Barrier for Cu Metallization

Recommend Documents

A Study on CVD TaN as a Diffusion Barrier for Cu Interconnects

Comparison of Amorphous and Polycrystalline Tungsten Nitride Diffusion Barrier for MOCVD-Cu Metallization

Structural and Electrical Characterization of Si-Implanted TiN as a Diffusion Barrier for Cu Metallization

TiB 2 as a Diffusion Barrier for Cu/<si> Metallization

Characterization of Atomic Layer Deposited Ultrathin HfO 2 Film as a Diffusion Barrier in Cu Metallization

Comparison of Ru/Ta and Ru/TaN as Barrier Stack for Copper Metallization

TiN prepared by plasma source ion implantation of nitrogen into Ti as a diffusion barrier for Si/Cu metallization

Amorphous Ti-Si-N Barrier Metal for Cu Metallization on Ulsis

Properties of Tin Thin Films Deposited by ALCVD as Barrier for Cu Metallization

Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films

Study of Ta as a Diffusion Barrier in Cu/SiO 2 Structure

Integration of PECVD Tungsten Nitride as a Barrier Layer for Copper Metallization