Bioinspired construction of BN@polydopamine@Al 2 O 3 fillers for preparation of a polyimide dielectric composite with en
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Bioinspired construction of BN@polydopamine@Al2O3 fillers for preparation of a polyimide dielectric composite with enhanced thermal conductivity and breakdown strength Guangyu Duan1, Yutong Cao2, Jiayou Quan1, Zuming Hu1,* Jing Zhu1
, Yan Wang1, Junrong Yu1, and
1
State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai 201620, People’s Republic of China 2 Sinochem International Corporation, Shanghai 200126, People’s Republic of China
Received: 7 February 2020
ABSTRACT
Accepted: 21 March 2020
This paper reports that a novel polyimide dielectric composite with three-dimensional (3D) thermally conductive networks and enhanced breakdown strength was firstly fabricated by filling with core-double-shell structured F-BA fillers. The F-BA particles were composed of nano-sized boron nitride (nBN) and polydopamine-coated spherical alumina (PDA@Al2O3). Moreover, to ameliorate interfacial compatibility between F-BA fillers and PI matrix as well as restrain phonons scattering during propagation, 1,6-Diisocyanatohexane (HDI) was innovatively used as ‘‘bridge agent’’ to connect and functionalize nBN and PDA@Al2O3 particles to generate core-double-shell structure. The results revealed that breakdown strength of PI dielectric composite with 25 wt % F-BA fillers was increased to 146.3 MVm-1, showing an increment of 68.5% in comparison with that of pure PI. Furthermore, the thermal conductivity of F-BA/PI composite with 25 wt % F-BA fillers increases to 6.41 W/mK of inplane direction and 1.01 W/mK of through-plane direction, respectively, which shows 36 and 6 times higher than polyimide of 0.18 W/mK. For dielectric properties of F-BA/PI composite, the dielectric constant and loss are less than 3.5 and 0.02, respectively. Considering these properties, the prepared PI dielectric composite shows potential application in high-performance electronic devices.
Published online: 3 April 2020
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Springer Science+Business
Media, LLC, part of Springer Nature 2020
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https://doi.org/10.1007/s10853-020-04596-5
8171
J Mater Sci (2020) 55:8170–8184
Introduction Recent decades, due to the virtues of easy processability, low cost, durability and lightweight, polymer materials have been widely utilized as dielectric materials in applications of electronic devices, such as flexible printed circuits, electronic packaging materials, energy storage capacitors, thermal interface materials. [1–4]. However, with significant miniaturization, high integration and functionalization of advanced electronic devices, a large amount of waste heat can be produced and accumulate to generate hotpots, which can deteriorate the inner structure and further lead to an unavoidable reduction in electronic device reliability, as is known that the intrinsic thermal conductivities of polymers too poor to dissipate waste heat timely [3]. Under such circumstances, fabrication of high-performance dielectric materials with
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