Chemical vapor deposition kinetics of tungsten from WCl 6 onto nickel plate at elevated temperatures
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This work was supported by the United States Department of Energy, Office of Basic Energy Sciences, Division of Materials Science, under Grant No. DE-FGO2-84ER45158. The authors are thankful to Dr. Thomas Zacharia of the Oak Ridge National Laboratory for his comments on this work.
REFERENCES
Fig. 1--Surface tension of Fe-S and Fe-8 pct Ni-18 pet Cr-S alloys as a function of temperature and sulfur concentration.
1. P. Sahoo and T. DebRoy: Metall. Trans. B, 1987, vol. 18B, pp. 597-601. 2. P. Sahoo, M.M. Collur, and T. DebRoy: Metall. Trans. B, 1988, vol. 19B, pp. 967-72. 3. P. Sahoo, T. DebRoy, and M.J. McNallan: Metall. Trans. B, 1988, vol. 19B, pp. 483-91. 4. T. Zacharia, S.A. David, J.M. Vitek, and T. DebRoy: Weld. J. Res. Suppl., 1989, vol. 68 (12), pp. 499s-509s. 5. T. Zacharia, S.A. David, J.M. Vitek, and T. DebRoy: Weld. J. Res. Suppl., 1989, vol. 68 (12), pp. 510s-519s. 6. C.H.P. Lupis: Chemical Thermodynamics of Materials, Elsevier Science Publishing Co., New York, NY, 1983, p. 407. 7. K.S. Yeum, R. Speiser, and D.R. Poirier: Metalt. Trans. B, 1989, vol. 20B, pp. 693-703. 8. R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, and K.K. Kelly: Selected Values of Thermodynamic Properties of Binary Alloys, ASM INTERNATIONAL, Metals Park, OH, 1973, p. 701 and p. 852. 9. B.J. Keene: Int. Mater. Rev., 1988, vol. 33, pp. 1-37. 10. G.K. Sigworth and J.F. Elliott: Met. Sci., 1974, vol. 8, pp. 238-310.
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Chemical Vapor Deposition Kinetics of Tungsten from WCI8 onto Nickel Plate at Elevated Temperatures
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Fig. 2--Variation of the temperature coefficient of surface tension, d~r/dT, as a function of temperature and sulfur concentration. The solid lines represent the Fe-8 pct Ni-18 pct Cr-S alloy, and the dashed lines represent the binary Fe-S alloys. The numerical values on the curves are the weight percent sulfur values.
for the Fe-Ni-Cr-S system in the temperature range of interest in welding are not available. In view of the lack of data and the calculations presented in this communication, theoretical investigations of heat transfer and fluid flow in a stainless steel weld pool can be under560--VOLUME 22B, AUGUST 1991
Chemical vapor deposition (CVD) is used to place a protective surface coating on materials in order to improve their physical, chemical, and/or mechanical properties.{~l Tungsten is used widely for coating semiconductors and heat- and wear-resistant materials. Much work has been done on the thermodynamics and phenomenology of tungsten CVD, but the rate processes involved have not been studied extensively. This work was concerned with measuring the kinetics and determining the rate-controlling steps for W deposition on nickel substrate by the vapor-phase reduction of WC16 by H2. The impurity contents in the nickel used in this work are given in Table I. The substrate surface was B.S. CHUN, Professor, and C.W. WON, Associate Professor, are with the ERC for R
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