Circular diaphragm-based MOEMS pressure sensor using ring resonator
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ORIGINAL RESEARCH
Circular diaphragm-based MOEMS pressure sensor using ring resonator P. R. Yashaswini1
•
N. Mamatha2 • P. C. Srikanth1
Received: 20 December 2019 / Accepted: 30 September 2020 Bharati Vidyapeeth’s Institute of Computer Applications and Management 2020
Abstract A photonic crystal based MOEMS pressure sensor design is presented in this work. The key design element is a circular diaphragm made of silicon (Si), integrated with a hexagonal ring resonator in the middle. The novelty of the work is the arrangement of the holes in the Si diaphragm in triangular orientation and optimization of sensitivity for pressure sensing. The pressure is applied at the center of the diaphragm which resulted in deformation, stress, and strain. The minimum observable deformation is 1.0073 nm and is at 6.3 lPa. The corresponding change in the refractive index is calculated for the stress applied. The resonant wavelength obtained for without load is 1.598 lm. The shift in the resonant wavelength for different loads are observed and tabulated. The modeling tool used to extract the mechanical parameters is ANSYS multiphysics. For 2D modeling and simulation of the ring resonator structure, MEEP is used for the implementation of FDTD. The Q-factor observed is 12,245 and sensitivity reported as 316.15 nm/RIU respectively. Keywords MOEMS Diaphragm FDTD Ring resonator MEEP Photonic crystal DRIE SOI
& P. R. Yashaswini [email protected] N. Mamatha [email protected] P. C. Srikanth [email protected] 1
Department of ECE, Malnad College of Engineering, Hassan, Karnataka, India
2
Department of ECE, CMR Institute of Technology, Bangalore, Karnataka, India
1 Introduction The present work involves the design of micro opto electro mechanical system structures (MOEMS) which involves sensing or manipulating optical signals on a very small size scale using integrated mechanical and electrical systems. These devices are usually fabricated using standard micromachining technologies and optical sensors are an integral part of such devices. MOEMS is believed to become a hallmark of twenty first century manufacturing technology with numerous and diverse applications having a dramatic impact on everything from aerospace technology to biotechnology. MOEMS devices and structures merged with main theories of unified photonics and micromachining data provides many sensing benefits. MOEMS typically subordinate machine-driven microstructures, optical waveguides, and microelectronics utterly combined into a chip using micro-fabrication technology. These sensors can sense the change in atmosphere for mechanical, electromagnetic, chemical statistics, etc. A secure device is comprised of countless aspects of MOEMS chip with the Bosch deep reactive ion etching (DRIE) process on silicon on insulator (SOI) substrates. This chip comprises environmental sensors, actuators, and optical structures. These are used to sense mechanical parameters such as strain, stress, and deformation grounded on the dislocation. The technology abo
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