Co-firing of Low- and Middle Permittivity Dielectric Tapes in Low-Temperature Co-fired Ceramics
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Co-firing of Low- and Middle Permittivity Dielectric Tapes in Low-Temperature Co-fired Ceramics Jae-Hwan Park, Young-Jin Choi, and Jae-Gwan Park Materials Science and Technology Division, Korea Institute of Science and Technology, PO Box 131, Cheongryang, Seoul 130-650, Korea Abstract Compatibility in cofiring low-κ and middle-κ based on a same glass composition for the hybrid LTCC material systems was investigated. Designing of appropriate lithium borosilicate glass frit systems allowed us to develop an optimized glass frit system used for low-κ and middle-κ dielectric fillers, commonly. The effects of glass addition on the densification and electrical properties in low-κ and middle-κ dielectric materials were also examined. Controlling glass compositions and contents we tried to match low-κ and middle-κ tapes physically and chemically. Introduction As the next information society approaches, it accompanies a new progressing communication system technologies, development of wireless, digitalized, high technological, and portable electronic devices and requires the next generation of following chip-device technology with miniaturization and multi-functional integration. [1-2]. LTCC multilayer structures have been generally used as a concept of a 3D wiring circuit board to date, using low-permittivity dielectric compositions (typical permittivity is 4~9). To realize highly integrated and multi-functional LTCC modules, however, it is important to incorporate passive components such as resistors, capacitors, inductors, and other functional parts in LTCC multilayer structure. Eventually, LTCC packages will proceed to an all-in-one type module, which incorporate various passive components and functions, as illustrated in Fig.1. Among various components which could be realized in LTCC packages, resonators and internal capacitors are the most desirable. The internal capacitors are required typically to realize circuit decoupling monolithically in LTCC packages. The typical forms of the resonators are a strip or a microstrip line of quarter wavelength on the substrate. The appropriate permittivity range for the resonators and the internal capacitors is 20~500.
Figure 1. An illustration of (a) a future multi-functional LTCC module and (b) defects induced by the physical and chemical incompatibilities between hetero LTCC layers. There have been several investigations on the middle-κ LTCC compositions [3-4]. Some
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microwave dielectric materials were reported to be sintered at the lower temperature range with addition of an appropriate amount of sintering aids such as oxides or glass frit. As illustrated in Fig. 1 (a), the low-κ as well as the middle-κ materials is required for realizing highly complicated and multifunctional modules. When the low-κ and middle-κ LTCC tapes are laminated and cofired in a module, the physical and chemical compatibilities between low-κ and middle-κ hetero layers should be considered carefully in the development of middle-κ LTCC materials. As shown in Fig. 1(b), there might be del
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