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Conducting polymer‑based electrically conductive adhesive materials: design, fabrication, properties, and applications Hossein Derakhshankhah1 · Rahim Mohammad‑Rezaei2 · Bakhshali Massoumi3 · Mojtaba Abbasian3 · Aram Rezaei4 · Hadi Samadian4 · Mehdi Jaymand4  Received: 12 March 2020 / Accepted: 1 June 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020

Abstract In the past few decades, increasing demands for electrically conductive adhesives (ECAs) have led to growing interest in the design and development of innovative strategies to obtain materials with synergetic or complementary properties for various industrial as well as biomedical applications. In this context, the replacement of traditional tin/lead (Sn/Pb) solders due to their corrosion, low strength of joints, solder joint fatigue, stress-induced cracking within the interconnect, as well as environmental issues are attracted a great deal of interests, especially in industrial committees. The significant progress in polymer science as well as the advent of nanotechnology, have been led to design and development of alternative materials with higher performance over conventional adhesives. On the other hand, intrinsically conductive polymers (ICPs) offer promising materials for the replacement or reducing the content of metallic fillers (e.g., silver, gold, nickel, or copper) in ECAs due to some disadvantages of metallic fillers. For the first time, an overview of the recent progress in the design, fabrication, and applications of the ECAs based on ICPs is presented.

1 Introduction In general, electrically conductive adhesives (ECAs) are composite materials containing an insulating adhesive binder resin (that provide adhesion, mechanical strength, and impact strength) and a conductive filler. The widely used binder resins in ECAs are epoxy, silicone, polyamide, and polyurethane (PU). The most popular fillers that conducts electricity are metallic micro- and/or nano-particles such as silver, gold, nickel, and copper [1–3]. Among these, epoxy and silver are the most commonly used materials for the fabrication of ECAs. These resin-based ECAs have received * Mehdi Jaymand [email protected]; [email protected] 1



Pharmaceutical Sciences Research Center, Health Institute, Kermanshah University of Medical Sciences, Kermanshah, Iran

2



Electrochemistry Research Laboratory, Faculty of Basic Sciences, Azarbaijan Shahid Madani University, Tabriz, Iran

3

Department of Chemistry, Payame Noor University, Tehran, Iran

4

Nano Drug Delivery Research Center, Health Technology Institute, Kermanshah University of Medical Sciences, Kermanshah, Iran



a great deal of interest as traditional solder alternative due to their some superior features, including low-temperature processing, finer pitch capability, and environmental friendliness, reducing the weight and cost, more flexible, higher stiffness and load transmission, the possibility to bind diverse materials (not only metals) together, excellent thermo-oxidative aging properties