Correction to: Influence of Cu incorporation on ionic conductivity and dielectric relaxation mechanism in NiO thin films

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AUTHOR CORRECTION

Correction to: Influence of Cu incorporation on ionic conductivity and dielectric relaxation mechanism in NiO thin films synthesized by CBD M. R. Das1 · A. Mukherjee1 · P. Mitra1

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Correction to: Journal of Materials Science: Materials in Electronics (2018) 29:1216–1231 https​://doi.org/10.1007/s1085​4-017-8024-x

The original version of this article contained an error in figure.

Figure 11 was inadvertently submitted wrongly and published in the original article. The corrected version of Fig. 11 is given below. The figure caption will remains the same as in the original article. This has been corrected with this erratum.

The original article can be found online at https​://doi.org/10.1007/ s1085​4-017-8024-x. * P. Mitra [email protected] 1



Department of Physics, The University of Burdwan, Burdwan, West Bengal 713104, India

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Journal of Materials Science: Materials in Electronics

(a)

(b)

(c)

Fig. 11  The frequency spectra of imaginary part of electric modulus at different temperature for a NiO; b 7% Cu:NiO; frequency spectra of imaginary part of electric modulus for all the films at a fixed temperature 320 °C shown in c 

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