Crack interaction study in piezoelectric materials under thermo-electro-mechanical loading environment
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Crack interaction study in piezoelectric materials under thermo-electro-mechanical loading environment Ranjan Mishra . Ramesh Gupta Burela . Himanshu Pathak
Received: 25 February 2018 / Accepted: 3 August 2018 Springer Nature B.V. 2018
Abstract Multiple voids and cracks were generated during material processing techniques, which interact with each other and affects the service performance of piezoelectric components. This work aims to study the behavior of piezoelectric components in presence of multiple cracks under thermo-electro-mechanical loading environment. Extended finite element method has been implemented to model geometrical discontinuities with crack interaction phenomenon. In this work, thermo-electro- mechanical problem has been decoupled into thermal and electro-elastic problems. Temperature distribution has been obtained by solving heat conduction equation and then used as an input to the electro-elastic problem. In post processing phase, interaction integral method and generalized Stroh formalism were used to predict the stress intensity factors. The methodology has been implemented with in-house developed MATLAB code. Set of cases for crack interaction studies were presented using the proposed approach. Keywords Crack interaction Piezoelectric Thermo-electro-mechanical loading SIFs XFEM R. Mishra R. G. Burela Department of Mechanical Engineering, Shiv Nadar University, Gautam Buddha Nagar, Uttar Pradesh, India H. Pathak (&) School of Engineering, IIT Mandi, VPO Kamand, Mandi, Himachal Pradesh, India e-mail: [email protected]
1 Introduction With the growing applications of engineering smart materials in electronic devices such as electro-mechanical actuators/transducers/smart sensors/ultrasonic generators, aircraft industry and so forth, the study of piezoelectric materials has been reported considerable attention in recent years. Due to effective intrinsic electro-mechanical coupling features, smart piezoelectric materials are used for fabrication of such devices. Piezoelectric materials are inherently inhomogeneous and brittle in nature with low fracture toughness (Pasharavesh 2017). As a result of heterogeneity, field coupling effects, geometrical imperfections (flaws, edges and electrodes) or defects such as voids, cracks, inclusions resulting from manufacturing and in-service loading, smart piezoelectric materials may be exposed to high thermo-electro-mechanical field concentrations during operation and these may experience high stresses and high electric field concentrations and as a result of which they may fail because of dielectric breakdown. However, stress concentration at the defects such as cracks, voids, holes and inclusions that can give rise to critical crackgrowth and often induce subsequent failure of such smart materials. Thermal effects such as pyroelectric effect and temperature-induced deformation in piezoelectric solids are very much important for the fabrication of such devices like micro-electro-mechanical sys
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