Direct Metal Nano-patterning Using Embossed Solid Electrolyte
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1156-D07-04
Direct Metal Nano-patterning Using Embossed Solid Electrolyte Anil Kumar, Keng Hsu, Kyle Jacobs, Placid Ferreira, and Nicholas Fang Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, University of Illinois, Urbana-Champaign, IL 61801 U.S.A.
ABSTRACT In this letter we introduce a new approach to fabricating nano-scale metallic features by combining best merits of micro-forming, nanoimprint lithography, and electrochemical nanoimprinting. We study the mechanical properties of Ag2S, a solid-state superionic conductor previously reported by Hsu et al. [1] for electrochemical nanoimprinting (S4 process), and explore its capability for embossing using a Si mold fabricated using electron-beam lithography. By circumventing the traditional route of stamp preparation using Focused Ion Beam (FIB), we greatly enhance the capability of electrochemical nanoimprinting. Using an embossed stamp, we demonstrate features 30 mm2. Application of an embossed Ag2S stamp is a significant step towards extending the S4 process for direct metal patterning of features beyond the capability of current processes.
INTRODUCTION Last few decades have seen a huge surge in nanotechnology which is expected to continue in future. This growth has been fueled by innovations in optoelectronics, nanoelectronics, nanooptics, nanoelectromechanical systems and various sensing applications including chemical and biological sensing. One of the basic building blocks of this growth is the ability to fabricate nanostructures with ever smaller features, good repeatability, and at lower cost and larger scales. Traditionally, photolithography has been the main process for fulfilling this demand. For features beyond the capability of photolithography, electron-beam lithography has been used [2, 3]. Recently, nano-imprint lithography has been very successful in scaling down the feature size while retaining the cost benefit [2-6]. It uses a Si or metal mold which is pressed (termed as microforming) into a photoresist followed by metal evaporation and lift-off. These Si or metal mechanical parts, i.e., the molds are typically made by well-developed technologies such as micromachining, EDM, microforming, and etching (RIE) of e-beam patterns in case of imprint lithography. Attributed to its relatively low cost and ease in tooling and processing, microforming has recently received attention in further expanding its workablematerial domain and reducing final feature dimensions. An intrinsic limitation of using this process to fabricate a large number of tiny metallic features over a large area lies in the force required to drive such an operation as well as the effect of global material flow on local features. Issues such as changes in mechanical properties of the features and undesired feature deformation can result. Therefore, the knowledge of mechanical properties of the surface to be microformed and its behavior during the process are important.
Here we report a new process to create nano-scale metallic features through the combin
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