Direct writing of polymer thick film resistors using a novel laser transfer technique
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H.D. Wu SFA, Inc., Largo, Maryland 20774 and Naval Research Laboratory, Code 6372, Washington, DC 20052
R.C.Y. Auyeung Naval Research Laboratory, Code 6372, Washington, DC 20052
C.M. Gilmore Department of Mechanical and Aerospace Engineering, The George Washington University, Washington, DC 20052, and Naval Research Laboratory, Code 6372, Washington, DC 20052
D.B. Chrisey Naval Research Laboratory, Code 6372, Washington, DC 20052 (Received 25 May 2001; accepted 29 August 2001)
Polymer thick film (PTF) resistors were fabricated using a new laser-based transfer technique called matrix-assisted pulsed laser evaporation direct write (MAPLE-DW). MAPLE-DW is a versatile direct writing technique capable of writing a wide variety of materials on virtually any substrate in air and at room temperature. Epoxy-based PTF resistors spanning four decades of sheet resistances (10 ⍀/sq. to 100 k⍀/sq.) were deposited on alumina substrates under ambient conditions. Electrical characteristics of these MAPLE-DW deposited resistors were studied at a wide frequency range (1 MHz to 1.8 GHz), and the results were explained through an equivalent circuit model and impedance spectroscopy. Temperature coefficient of resistance measurements for the PTF resistors were performed between 25 and 125 °C. The results based on the percolation theory were used to explain the temperature dependence of the resistance behavior of the PTF resistors. I. INTRODUCTION
Rapid growth in the electronics industry has necessitated new developments in thick-film technology for efficient manufacturing of hybrid microelectronics circuitry.1–3 With the increasing demand for smaller, faster, and lower-cost devices, new challenges have emerged for integral passive technology involving the fabrication of resistors, capacitors, inductors, and interconnects especially on low-temperature flexible or polymer substrates. Thick-film technology4 is still dominated by conventional manufacturing techniques like screen-printing and tape casting with subsequent firing at high temperatures to fabricate various passive devices. These techniques suffer from a number of limitations like poor feature resolution (approximately 100 m) and high processing
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J. Mater. Res., Vol. 16, No. 11, Nov 2001 Downloaded: 02 Apr 2015
temperatures (approximately 850 °C), which make them unsuitable for polymer substrates and also incompatible with computer-aided design/computer-aided manufacturing (CAD/CAM) tools for rapid prototyping applications. In view of the aforementioned limitations, direct-write technologies offer a totally different and novel approach to fabricate mesoscopic (about 10 m to approximately 5 mm size) passive electronic devices. These provide flexible, maskless, and efficient techniques for depositing a wide variety of materials on virtually any substrate under ambient conditions that can be easily integrated into a CAD/CAM system. Direct-write methods are not me
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