Dry Etching Technology for Semiconductors
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the
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Dry Etching Technology for Semiconductors
Dry Etching Technology for Semiconductors Translation supervised by Kazuo Nojiri Translation by Yuki Ikezi
Kazuo Nojiri
Dry Etching Technology for Semiconductors
Kazuo Nojiri Lam Research Co., Ltd. Tokyo, Japan
Based on translation from the Japanese language edition: HAJIMETE NO HANDOTAI DRY ETCHING GIJUTSU by Kazuo Nojiri Copyright © 2012 Kazuo Nojiri All rights reserved. ISBN 978-3-319-10294-8 ISBN 978-3-319-10295-5 (eBook) DOI 10.1007/978-3-319-10295-5 Springer Cham Heidelberg New York Dordrecht London Library of Congress Control Number: 2014949262 © Springer International Publishing Switzerland 2015 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. Exempted from this legal reservation are brief excerpts in connection with reviews or scholarly analysis or material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. Duplication of this publication or parts thereof is permitted only under the provisions of the Copyright Law of the Publisher’s location, in its current version, and permission for use must always be obtained from Springer. Permissions for use may be obtained through RightsLink at the Copyright Clearance Center. Violations are liable to prosecution under the respective Copyright Law. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. While the advice and information in this book are believed to be true and accurate at the date of publication, neither the authors nor the editors nor the publisher can accept any legal responsibility for any errors or omissions that may be made. The publisher makes no warranty, express or implied, with respect to the material contained herein. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Preface
Dry etching is a key technology comparable in importance to lithography as a means for scaling and enhancing the integration level of semiconductor devices. The number of engineers engaged in dry etching development is also comparable to those working on lithography. Lithography technology is relatively easy to understand because resolution is determined by the optical wavelength and the numerical aperture (NA) of a lens. On the other hand, dry etching technology is difficult to understand because of the complicated phenomena taking place inside the etch chambe
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