Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al
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Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications Vigneshwarram Kumaresan1,2, Srimala Sreekantan1,* Khairudin Mohamed3
, Mutharasu Devarajan2, and
1
School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Pulau Pinang, Malaysia 2 Materials Centre of Excellence (MCoE), PTDI, Western Digital Corporation, Batu Kawan 14100, Pulau Pinang, Malaysia 3 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Pulau Pinang, Malaysia
Received: 1 September 2020
ABSTRACT
Accepted: 9 November 2020
A high thermal conducting, electrically insulating, and non-oil bleed liquid thermal gap filler containing aluminum oxide (Al2O310 lm) and zinc oxide (ZnO0.6 lm) in polydimethylsiloxane (PDMS) has been fabricated. An effective method of mixing 93 wt% filler in 7 wt% PDMS was achieved without surface modification. It was found that the thermal conductivity, hardness, dielectric constant, and dielectric loss tangent values increased with the variation of filler ratio. The S5 hybrid composite exhibits the highest thermal conductivity of 3.38 W/m K, which was 21.1 times higher than that of pure PDMS. The corresponding dielectric constant and dielectric loss were 7.968 and 0.03076 at 1 MHz. TGA results revealed that the variation of Al2O3/ZnO filler ratio improved the maximum decomposition temperature of the composite. Furthermore, no oil bleed was observed for the entire composites after 1 month. Thus, fillers with different particle sizes provide more significant filler packing density in the matrix and lower thermal resistance between adjacent conductive filler, resulting in high thermal conductivity composites.
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Springer Science+Business
Media, LLC, part of Springer Nature 2020
1 Introduction In the past few decades, increasing frequency (clock speed), power density (level of integration), multichip module (MCM), system in package (SIP), 3D
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https://doi.org/10.1007/s10854-020-04864-9
packaging coupled with lower product costs have been driving new packaging technologies [1]. The power density of microprocessor has increased to 100 W/cm2 and power density of electronics packaging is expected to reach beyond 1 kW/cm2 for
J Mater Sci: Mater Electron
next-generation devices [2]. Thus, the heat generated by devices and other circuitry must be dissipated to avoid premature failure. In response to these critical needs, breakthroughs are required in advanced thermal management solutions. Thermal interface materials (TIMs) play a critical role in the thermal management of electronics packaging by providing a path of low thermal impedance between the die and the heat sink [3]. Currently, various TIMs such as thermal pad [4–6], liquid thermal gap filler (liquid thermal interface materials) [7], thermally conductive adhesive tapes [8–1
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