Effect of Metallic Glass Particle Size on the Contact Resistance of Ag/Metallic Glass Electrode
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TRODUCTION
AS the competition between the conventional and renewable energy sources has become more intense, the demand for reducing the cost of energy generation has been grown.[1] For the next generation solar cell device, new types of solar cell devices with high cell efficiency have been developed. At the same time, the high performance electrodes were strongly demanded for maintaining the cell efficiency.[1] It is known that the electrical properties of electrode are crucial factors for the realization of cell performance. Because the device structure is evolved more efficiently to produce more electrons and shorten the electron pathway and collect more electrons, the electrode should have the extremely low electrical resistance for collecting and delivering more electrons to restrict the geometry of electrode. JIN MAN PARK, KEUM HWAN PARK, EUN SOO PARK, Senior Engineers, and SEOK-MOO HONG, Research Staff, Principal Engineer, are with the Global Technology Center, Samsung Electronics Co., Ltd, 129 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 443-742, Republic of Korea. Contact e-mails: jinman_park@hotmail. com; [email protected] SE YUN KIM, Research Staff, SANG SOO JEE, R&D Staff, and EUN SUNG LEE, Research Staff, are with the Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co., Ltd, 130 Samsung-ro, Yeongtong-gu, Suwonsi, Gyeonggi-do 443-803, Republic of Korea. Contact e-mail: sangsoo. [email protected] SUCK JUN KIM, Professor, is with the School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education, 1600 Chungjeol-ro, Byeongchunmyun, Cheonan 330-708, Republic of Korea. KI BUEM KIM, Professor, is with Hybrid Materials Center (HMC), Faculty of Nanotechnology and Advanced Materials Engineering, Sejong University, 209 Neungdong-ro, Gwangjin-gu, Seoul 143-747, Republic of Korea. DO HYANG KIM, Professor, is with the Center for Non-Crystalline Materials, Department of Materials Science and Engineering, Yonsei University, 134 Shinchondong, Seodaemun-ku, Seoul 120-749, Republic of Korea. JU¨RGEN ECKERT, Director and Professor, is with the Institute for Complex Materials, IFW Dresden, 01171 Dresden, Germany, and also with the Institute of Materials Science, TU Dresden, 01062 Dresden, Germany. Manuscript submitted March 20, 2014. Article published online March 19, 2015 METALLURGICAL AND MATERIALS TRANSACTIONS A
Recently, various methods including electroplating, metal deposition, and screen printing of Ag paste with dopants were introduced to achieve the low contact resistance of electrodes.[2–5] Among them, screen printing of Ag electrodes has been considered as a basic electrode formation method due to the cost-effective way.[6] The Ag paste is normally composed of three main ingredients: silver, glass frit, and organic additives.[7,8] Here, glass frit provides the adhesion between Ag electrode and silicon (Si) substrate and also offers electron pathway via the electron hopping mechanism.[9] The dissolved metal ions into glass, such as Pb and Ag, are precipitated a
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