Effect of plastic deformation on residual stresses in ceramic/metal interfaces
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Effect of Plastic Deformation on Residual Stresses in Ceramic/Metal Interfaces YUNHONG ZHOU, KENJI IKEUCHI, THOMAS H. NORTH, and ZHIRUI WANG Considerable effort has been made to develop interlayer materials which minimize the residual stresses produced by thermal expansion mismatch during ceramic/ metal joining. In spite of previous studies, it is still not clear which combination of factors controls interlayer selection. Naka e t al. [11 examined the joining of Si3N4 to other ceramics, such as alumina and zirconia, and to metal substrates, such as Fe, Cu, Invar, Kovar, and AISI stainless steel, using amorphous Cu-Ti filler metal and concluded that tensile strength of the joint decreased as the difference in thermal expansivities of the ceramic and the metal substrate increased. Also, the tensile strength of ceramic/metal joints decreased as the product of the thermal expansivity and the elastic modulus of the metal substrate increased. Nicholas and Crispin t2] also found a clear relation between final joint strength and increasing thermal expansivity mismatch during diffusion bonding of alumina to different metal substrates. These results were explained on the basis that high thermal mismatch stresses facilitated joint failure at low applied loads. Based on these results, the interlayer material should have a thermal expansivity as close as possible to that of the cer
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