Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints
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Effect of thermal cycles on interface and mechanical property of lowAg Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints Lei Sun1 · Ming‑he Chen1 · Chun‑chun Wei1 · Liang Zhang2 · Fan Yang2 Received: 24 January 2018 / Accepted: 29 March 2018 © Springer Science+Business Media, LLC, part of Springer Nature 2018
Abstract Low-Ag content SnAgCu solder has drawn more and more researchers’ attention due to the low cost. In this paper, the effect of 0.1 wt% nano-Al particles on interface reaction between Sn1.0Ag0.5Cu and Cu substrate was investigated, and the growth of intermetallic compounds (IMC) and mechanical property of solder joints during − 55 to 125 °C thermal cycling were also analyzed. The results show that the C u6Sn5 IMC formed at the as-soldered interface and grow obviously with the increase of thermal cycling. The growth rate of IMC in the SnAgCu–0.1Al/Cu is lower than that of SnAgCu/Cu, which indicates that the nano-Al particles can inhibit the diffusion coefficient of IMC layers. Moreover, the shear force of two kinds of solder joints decrease during thermal cycling, but the shear force of SnAgCu–0.1Al is higher than that of SnAgCu.
1 Introduction With the development of miniaturization and high integration of microelectronic packaging, the working environment of consumer electronics has become more demanding [1]. During the service of consumer electronics, the heat, generated by the consumer electronics, will cause the solder joint to be in a hot environment for a long time, which will accelerate the diffusion of elements and lead to the excessive growth of brittle IMC [2]. Moreover, when the electronics run, the solder joints are affected by different temperatures for a long time in the state of power and power outage. Due to the different thermal expansion coefficient of the material, the solder joints are subjected to periodic stress and strain, and finally the solder joints fail [3]. Therefore, it is very important to understand the interfacial reaction and mechanical properties of solder joints subjected to thermal cycling. Traditional tin–lead solder alloys, such as Sn37Pb and Sn36Pb2Ag, have been widely used for microelectronics packaging because of their low cost and excellent * Ming‑he Chen [email protected] 1
College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
2
weldability [4, 5]. However, lead is unfriendly to our environment and bodies, many governments have passed laws to prohibit the use of tin–lead solder in consumer electronics, such as the directive on Waste Electrical and Electronic Equipment (WEEE) and the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment (RoHS) [6–8]. Consequently, the development of lead-free solder has become a hot topic in this field. SnAgCu solder alloys are attracting more attention due to their good welding performance, low melting temperature and superior
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