Effects of brazing temperature and holding time on wettability of brazing diamond and brazing interface analysis
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RESEARCH PAPER
Effects of brazing temperature and holding time on wettability of brazing diamond and brazing interface analysis Jigang Chen 1,2 & Xiaokang Wang 1 & Xiangrui Li 1 & Na Li 1 & Qingxiang Yang 2,3 Received: 7 January 2020 / Accepted: 30 June 2020 # International Institute of Welding 2020
Abstract This paper aims to study the effects of different brazing temperatures and holding time on the exposing height of the brazing diamond and wetting angle of the solder, and to analyze the morphology and composition of the reaction products at the interface between the diamond and the solder. Using the Ni-Cr-B-Si composite solder, the orderly arrangement method, the flame spraying process, and the remelting technology–based vacuum carbon tube furnace, the sample block with single layer ordered diamond is prepared. The results show that with the increasing of brazing temperature, the exposing height of the diamond, and the wetting angle of the solder decrease, and with the increasing of holding time, the exposing height of the diamond increases, and the wetting angle of the solder decreases. In addition, the fine acicular Cr-C compounds are formed at the brazing interface between diamond and solder, which prevents the increasing of wetting capacity of solder. The study of the effects of brazing temperature and holding time on the brazing quality, and the analysis of the morphology and composition of the products in the brazing interface, provide important technical and theoretical support for the better production of brazing diamond tools. Keywords Diamond tools . Brazing temperature . Holding time . Surface morphology . Exposing height . Wetting angle
1 Introduction The structure-based engineering of ceramic materials has been used more and more widely in aerospace, automotive, electronics, medical, and other fields of the advanced equipment [1]. However, the mechanical processing performance of engineering ceramics is very poor, and the processing tools are required to be higher. At present, the machining removal method of ceramic materials is mainly based on grinding. As a super-hard
Recommended for publication by Commission XVII - Brazing, Soldering and Diffusion Bonding * Jigang Chen [email protected] 1
School of Mechanical Engineering, Yanshan University, Qinhuangdao 066004 China
2
Aviation Key Laboratory of Science and Technology on Generic Technology of Aviation Self-Lubricating Spherical Plain Bearing, Yanshan University, Qinhuangdao 066004 China
3
School of Material Science and Engineering, Yanshan University, Qinhuangdao 066004 China
abrasive, diamond has been used widely in wire drawing dies, dressing tools, drilling tools, sawing tools, etc. [2]. The brazing diamond tool with ordered particles has the advantages of large chip space, high sharpness, and strong holding force with matrix. Therefore, the brazing diamond tool and its processes have become a hot topic of ceramic tool research [3]. In the research of brazing diamond tools, Ni-Cr-B-Si or Ag-Cu-Ti and other alloys are generally used as
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