• PDF / 561,417 Bytes
• 6 Pages / 612 x 792 pts (letter) Page_size
• 81 Downloads / 218 Views

DOWNLOAD

REPORT

K.N. Tu Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, California 90095-1595 (Received 9 February 2008; accepted 16 April 2008)

Electromigration at 5 × 104 A/cm2 and 100 °C was conducted to grow composite Pb/Sn whiskers from SnPb solders, in which a Pb whisker grows first and then a whisker of Sn grows. In some cases, small Sn islands are embedded in Pb whiskers. The diameter of a composite whisker is 60 °C via electromigration. However, only hillocks existed at low current densities. A current density

Recommend Documents

Growth of Cu-Ni-Sn Alloys in Pb Free CuSnAg Solder/Au-Ni Metallization Reactions

166 80 524KB

Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes

217 5 26MB

Layer growth in Au-Pb/In solder joints

200 61 3MB

Effect of La on the Growth of Cu 6 Sn 5 Intermetallic Compound for Improved Sn-Pb Solder Joints

196 36 641KB

Interdiffusion of Sn and Pb in liquid Pb-Sn alloys

186 88 199KB

Whisker Formation in Sn Coatings on Cu

181 22 113KB

A Nonlinear Viscous Model for Sn-Whisker Growth

258 81 523KB

Kinetics of Sn whisker growth from Sn thin-films on Cu substrate

180 48 3MB

Microstructure evolution during electromigration in eutectic SnPb solder bumps

199 11 3MB

Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects

266 0 11MB

Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characteriza

211 26 973KB

Interface undercoolings during the growth of Pb-Sn eutectics

172 15 566KB