Enhanced thermal conductivity and electrically insulating of polymer composites
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Enhanced thermal conductivity and electrically insulating of polymer composites Ziwei Xu1, Yirong Chen1, Xiang Chen2, Jingjing Zhang1,* Xiaoling Fu1, Fei Wu1, and Peng Zhang1 1 2
, Shijun Huang1, Anfu Chen1,
School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, People’s Republic of China School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, People’s Republic of China
Received: 26 August 2020
ABSTRACT
Accepted: 2 November 2020
Highly thermally conductive but electrically insulating polymer composites play an increasingly important role in thermal management applications due to their features of easy processing and lightweight. Herein, a unique segregated network, which consists of graphene nanoplatelets (GNP) and boron nitride fibers (BNF), was constructed in polypropylene (PP)-based composites via twoscrew extrusion. The thermal conductivity and electrical insulation characteristic of the composites could be well controlled by adjusting the content and size of GNP and BNF. When PP was filled with 9wt% GNP and 30wt% short BNF, the highest thermal conductivity of 1.32 W/(mK) was achieved in this work, which is about six times higher than the value of neat PP, while remained a good electrical insulating (as low as 2.98 9 10-9 S/m). It proposed that the unique segregated network, where the BNF play as a bridge to connect the scattered GNP, could benefit for phonons transmission but effectively interrupt electron conduction. Our work provides a facile method to design and fabricate the highly thermally conductive but electrically insulating composites applied in thermal management materials.
Published online: 16 November 2020
Ó
Springer Science+Business
Media, LLC, part of Springer Nature 2020
Introduction In recent years, polymer-based composites have been extensively considered for use in electronic packaging, heat exchangers, electrical energy storage, and gate dielectrics due to their high resistivity, low cost, lightweight, and simple fabrication process [1–3].
Handling Editor: Catalin Croitoru.
Address correspondence to E-mail: [email protected]
https://doi.org/10.1007/s10853-020-05530-5
However, with the rapid escalation of power densities and miniaturization of electronic components, the large amount of heat generated during the operation of these electronic components would accumulate in a smaller volume [4, 5]. Consequently, high temperatures could have detrimental effects on the stability, reliability, and longevity of electronic components [6]. For example, the excessive heat could
4226 jeopardize the connection interface of the circuit, increase the resistance of the conductor, and cause mechanical stress damage. Therefore, it is ensured that the generated heat could be dissipated from the electronic components as quickly and efficiently as possible, which has become an essential aspect of the assembly of the microelectronics devices with high integration level [7, 8]. As a result, the composites used for electronic p
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