Enhancing Semiconductors with Diamond
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0956-J08-01
Enhancing Semiconductors with Diamond Jerry W. Zimmer sp3 Diamond Technologies, 2220 Martin Ave., Santa Clara, CA, 95050
ABSTRACT In the continuing thrust to extend Moore’s law, silicon is beginning to confront several issues that require innovative materials solutions to increase transistor and interconnect speeds while dealing with the increasing thermal loads of advanced microprocessors. The unsurpassed thermal and mechanical properties of diamond can be profitably exploited to enhance the performance characteristics of silicon based circuits. The discussion focuses primarily on the integration of diamond with silicon for the manufacture of silicon on diamond (SOD) wafers for spreading heat from hot spots in microprocessors. Other interesting property combinations are also presented as food for thought regarding other possible enhancements to silicon device performance. Recent data and prognosis for the future will be presented. INTRODUCTION Diamond has been suggested as a replacement for silicon in the electronic world but that goal is both elusive and long term with many possible competing technologies. The current view of many in the semiconductor industry is that competing with silicon in its core areas (computing, communication, entertainment, etc, etc--) is a no win situation for both diamond and silicon. From the perspective of the semiconductor industry the best role for diamond is in enhancing silicon and compound semiconductors – not competing with silicon. The question then becomes how diamond can best be used to enhance silicon and other semiconductor materials. Moore’s Law in semiconductor manufacturing states that, for a given cost, the capabilities of technology double every eighteen months. Unfortunately, there are a number of issues which conspire to limit this progression with current technologies. Transmission speed on interconnect lines, mobility in silicon device channels, and dissipation of speed related heat generation are all beginning to challenge the current materials used in semiconductors. Fortunately, diamond can help solve some of these problems and extend Moore’s law by enhancing some of the properties of silicon that currently limit its performance.
DISCUSSION
Opportunities Diamond is a unique material in many ways and examination of its various thermal and mechanical properties reveals a number of ways in which it can be used to enhance and improve the properties of standard silicon devices. Figures 1-4 show some of these properties and how they compare to other materials. Careful examination of Figure 1 shows that diamond occupies a unique niche where it has both high strength and stiffness coupled with relatively low density and dielectric constant. When this is coupled to the high thermal conductivity and high breakdown voltage of undoped diamond then there are several interesting application possibilities for diamond in the dielectric layers of semiconductor devices. Novel Material Properties – E, κ, and r 74
970
Dielectric Constant - κ
2 iO T
54
dn o m a
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