Experimental Investigation on the Vapor Chambers with Sintered Copper Powder Wick
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https://doi.org/10.1007/s11630-020-1366-3
Article ID: 1003-2169(2020)00-0000-00
Experimental Investigation on the Vapor Chambers with Sintered Copper Powder Wick HUANG Dou1, JIA Li1*, WU Hong2*, AAKER Olav2 1. Beijing Key Laboratory of Flow and Heat Transfer of Phase Changing in Micro and Small Scale, School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing 100044, China 2. Faculty of Engineering, Østfold University College, Box700, N-1757, Norway © Science Press, Institute of Engineering Thermophysics, CAS and Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract: High power electronics units generate high-density heat flux, which poses a significant threat to the reliability of these devices. The vapor chamber (VC) has a very high heat transfer rate and has a wide range of applications in the heat dissipation of electronic products. VCs with sintered copper powder wicks sized as irregular shape copper powder 50 μm (I-50 μm), I-75 μm, I-110 μm, I-150 μm were studied in this paper. The effect of liquid filling ratio was discussed. The results indicated that the thermal resistance of all VCs decreased with the increase of heating power. The capillary performance of wick was the dominant factor for the heat transfer performance of VCs with different kinds of wick. A capillary performance factor was proposed to evaluate the capillary performance of VCs. The capillary performance factor of VC with the wick of I-75 μm was much higher than that of the other types of VC in this study. The heat source surface temperature of VCs could be affected by filling ratio and wick structure. But, it should be insensitive to the filling ratio when a better capillary performance factor was obtained. With the same heating area and similar structure, the maximum heat flux density of the VC would decrease as the height of vapor cavity decreased.
Keywords: vapor chamber, copper powder, capillary performance, heat transfer performance, thermal resistance
1. Introduction The high heat flux generated inside the powered electronics unit poses a significant threat to the reliability of these devices. Since the failures caused by high temperature account for more than 50% of all electronic equipment failures [1], the heat dissipation problem has become a bottleneck in the development of these devices toward miniaturization [2]. In addition to the highest temperature control, electronic components also impose Received: Feb 04, 2020 Associated editor: LI Yinshi
requirements on temperature uniformity. Phase change heat transfer is an efficient heat transfer method to solve the heat dissipation in the field of power electronics (the coefficient of heat transfer can reach above 5000 W/(m2·K), but the coefficient of common convective heat transfer is below 1000 W/(m2·K)) [3]. The vapor chamber (VC) utilizes the phase change process of working fluid [4], and an efficient heat transfer process consists of absorbing and releasing latent heat. This process can effectively disperse the heat of
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