Experimental study on boiling performance of wetting fluids in three-dimensional rectangle microchannels
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ORIGINAL
Experimental study on boiling performance of wetting fluids in three-dimensional rectangle microchannels Ping-Yang Wang 1
&
Xing-Lin Zhao 1 & Zhen-Hua Liu 1
Received: 2 July 2019 / Accepted: 10 May 2020 # Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract A unique boiling heat transfer study of wetting fluids in a vertical three-dimensional rectangle microchannel was carried out in this paper, to develop a novel passive three-dimensional chip stack cooling technology. The base liquids were deionized water and R113, and Sodium dodecagon sulfate (SDS) was used as a surfactant, which is added into the base fluids for developing wetting fluids. The length, gap, and width of rectangle channels were in the range of 30 mm to 100 mm,30 mm to 50 mm, and 0.4 mm to 4 mm, respectively. Metal wires with different numbers were laid in the rectangle channel along the flow direction for forming change in the width of the microchannel. The study results show that using wetting fluids can significantly enhance both heat transfer coefficients and maximum heat flux of thermosyphon boiling in three-dimensional microchannels compared with that found in pure liquids. The enhanced effects have significant relations with the three-dimensional geometric dimensions. The present experimental results provide significant technology support for passive three-dimensional chip cooling. Keywords Wetting liquid, Thermosyphon . Boiling . Microchannel . Three-dimensional chip cooling
Nomenclature D hydrodynamic equivalent diameter (m) g gravity (m/s2) h heat transfer coefficient (W/(m2 · K)) hag latent heat of evaporation (J/kg) L height of 3D channel (m) I electric current (A) P power (W) q heat flux (W/m2) q” critical heat flux (W/m2) S surface area (m2) T temperature (°C) ΔT mean super-heating (K) U voltage (V) W width of the 3D channel (m) Electronic supplementary material The online version of this article (https://doi.org/10.1007/s00231-020-02883-0) contains supplementary material, which is available to authorized users. * Ping-Yang Wang [email protected] 1
School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Greek letters Φ dimensionless heat flux β contact angle (°) ρ density (kg/m3) μ dynamic viscosity (Pa · s) σ surface tension coefficient (N/m) ω mass fraction Subscripts 0 pure liquid s wetting liquid, or saturated temperature w heating surface loss heat loss
1 Introduction Microchannel boiling heat transfer is an efficient heat transfer method, which is favored because of its small temperature difference and high heat flux. It has been widely used in two-dimensional chip cooling technology [1]. The primary technical principle is that various forms of microchannel structures are arranged in the substrate. The external power forces the working medium to pass the microchannel, and at the same time, forced convective boiling generates. Forced convective boiling has a much higher heat transfer coefficient
Heat Mass Transfer
than simply forced convection. Of course, microc
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