Fabrication of high thermal conductive epoxy composite by adding hybrid of expanded graphite, iron (III) oxide, and silv
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Fabrication of high thermal conductive epoxy composite by adding hybrid of expanded graphite, iron (III) oxide, and silver flakes Rajesh Kumar1 · Sagar Kumar Nayak1 Received: 12 February 2020 / Accepted: 3 August 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract Thermally conductive epoxy adhesive composites have been fabricated by adding a tri-filler mixture of expanded graphite (EG), iron (III) oxide (Fe3O4), and silver (Ag) flakes with increasing concentration from 20 to 50 weight percent. The epoxy composite containing mixed filler of EG/Fe/Ag at 50 wt% has demonstrated diminutive higher thermal conductivity (TC) (4.85 W/mK) when compared to composite filled with EG/Fe hybrid (4.82 W/mK) at equivalent filler % which was about 25 fold improvement than epoxy unaided. The crystallography of the graphite flakes (GF), EG, neat epoxy, EG/Fe/Ag-epoxy, and EG/Fe-epoxy adhesive composites has been analyzed by X-ray diffraction (XRD) technique. The morphology of filler (EG and EG/Fe/Ag) and fractured surface analysis of corresponding epoxy composite has been carried out by scanning electron microscopy. The bonding strength through lap shear test of epoxy adhesives with the addition of 50 wt% of EG/ Fe/Ag mixed and EG/Fe hybrid fillers has been displayed a decreased value as compared to neat epoxy. At the primary phase analysis of thermal dilapidation, the thermo-gravimetric analysis (TGA) concluded a negative effect on the thermal constancy of epoxy composites at higher assimilation (> 35 wt%) of EG, Fe3O4, and Ag mixed fillers. The damping factor (tan δ) (0.44 and 0.43) and glass transition temperature of composite demonstrated lower value (70 and 64 °C) when 50 wt% of EG/Fe and EG/Fe/Ag were added.
1 Introduction Recently, polymer adhesive composites with higher TC have entrenched the attention of researchers to improve heat dissipation from the heat source to heat sink in a highly efficient electronic component. Despite low TC of epoxy resins (Ep) (~ 0.2 W/mK), the resins are manifested as composites, adhesives, and surface coatings, due to their high strength, stiffness, adhesion, and thermal stability. The intrinsic thermally conductive fillers are being incorporated in the epoxy resin to formulate thermally conductive epoxy adhesive [1–6]. Initially, the metallic-based fillers like silver (Ag), gold (Au), copper (Cu), and aluminum (Al), etc., were used in the epoxy matrix for the alternative soldering of electronic devices. However, the difficulty like high weight and metallic oxide formation prevents long-term reliability of the electronics circuits. Therefore, epoxy resin-based thermal * Sagar Kumar Nayak [email protected] 1
SARP‑Laboratory for Advanced Research in Polymeric Materials, Central Institute of Plastics Engineering and Technology, Bhubaneswar, Odisha 751024, India
conductive adhesive filled with silver flakes, nanowire, and nanoparticles with light carbon-based filler has become an alternative on metallic-based soldering and brazing. Various research
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