Formation of intermetallic compounds in SnPbAg, SnAg, and SnAgCu solders on Ni/Au metallization
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The author is thankful to Professor P.K. Rohatgi, University of Wisconsin–Milwaukee, for bringing the problem of infiltration of heterogeneous capillaries to his attention during a summer visiting faculty appointment with UW–Milwaukee. Support received from the Research Services and Technology Department, UW–Stout, is also acknowledged. REFERENCES 1. L.W. Schwartz and S. Garoff : Langmuir, 1985, vol. 1, p. 219. 2. A.W. Neumann and R.J. Good: J. Colloid Interface Sci., 1972, vol. 38, p. 341. 3. L. Boruvka and A.W. Neumann: J. Colloid Interface Sci., 1978, vol. 65 (2), p. 315. 2666—VOLUME 32A, OCTOBER 2001
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