Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging
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Ni-grain
Ferrite and/or Martensite
Heat-Treatment Condition
Pure*
Fe-M**
Total
Austenite
Carbides†
as-cast austenitized first tempered second tempered as-cast 15-min stress relieved 30-min stress relieved
43 30 40 41 17 14 15
35 43 40 41 20 20 21
78 73 80 82 37 34 36
0 8 0 0 7 6 3
22 19 20 18 56 60 61
*Pure: Fraction of Fe that does not have alloying elements at the first and second nearest neighbor sites in bcc or bct structure. **Fe-M: Fraction of Fe that has alloying elements at the first and second nearest neighbor sites in bcc or bct structure. †All carbides including Fe3C cementites.
The authors thank Professor Nack J. Kim, POSTECH, and Dr. Hui Choon Lee and Mr. Joon Wook Park, Kangwon Industries, Ltd., for their helpful discussion on microstructural analysis of the rolls.
Growth of a Au-Ni-Sn Intermetallic Compound on the SolderSubstrate Interface after Aging A.M. MINOR and J.W. MORRIS, Jr.
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