Homogeneous Ultrathin Diffusion Barriers Deposited on Low Dielectric Constant Polymers
- PDF / 343,923 Bytes
- 6 Pages / 420.48 x 639 pts Page_size
- 63 Downloads / 236 Views
Abstract TiN and TaN thin films are proposed as barrier layers between copper interconnects and low dielectric constant (low-k) polymers. As the barrier layer thickness is scaled down, the uniformity and morphology of these films will be severely affected by the nitride-polymer interface and become an important issue for the reliability of the whole interconnect structure. In order to evaluate nitride formation and the interfacial chemistry we deposited TiN and TaN on fully cured low-k polymers by two different techniques: reactive evaporation of the metal in nitrogen ambient and by ion assisted reactive deposition using a low energy (100 eV) nitrogen ion beam during evaporation. Photoelectron spectra were recorded in situ for metal coverages from 0.1 nm until bulk like metal or metal nitride spectra were obtained. Nitride concentrations, extracted from the photoelectron spectra, show that even though very similar nitride films are produced by both techniques for thicker films (>5 nm) we only find significant amounts of nitride at the interface in the ion assisted case. Thinner films formed in nitrogen ambient were very similar to those where the pure metal was deposited and were dominated by the formation of compounds with carbon and oxygen from the polymer. This shows that the composition of barrier layers can be drastically altered near the polymer interface. Low energy ions in contrast allow the growth of more homogeneous films which can significantly improve the reliability of copper based high density interconnects.
Introduction Titanium Nitride (TiN) and Tantalum Nitride (TaN) are tested as diffusion barriers between copper and low dielectric constant (low-k) polymers in the microelectronics industry"6 . There has been a significant amount of work done in the literature on the properties of nitride layers grown by a variety of methods: sputter deposited, reactive deposition, chemical vapor deposition, and plasma deposition. Generally the authors have examined the stoichiometry, electrical resistance, and grain structure of the barrier layer'-7 . While all of these properties are critical for its application as a barrier layer these experiments do not probe the properties near the TaN(TiN)/polymer interface. Extensive work has also been done for metal polymer interfaces 8 , showing a very complex chemistry. While this subject is still under investigation it is expected that nitride barrier layers have different compositions and properties at and near the interface. As the diffusion barriers are scaled down in thickness, this region becomes more important in controlling the overall properties of the barrier. This paper examines the effects of two growth techniques, reactive evaporation and ion assisted deposition, on the growth of TaN and TiN on Biphenyl Tetracarboxylic acid Dianhydride-para Phenylene Diamine (BPDA-PDA) and Benzocyclobutene (BCB). 51 Mat. Res. Soc. Symp. Proc. Vol. 563 ©1999 Materials Research Society
Experiment BPDA-PDA and BCB films were spin-coated on silicon wafers and cured in the stan
Data Loading...
