Inkjet-Printed Flexible Active Multilayered Structures

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Inkjet-Printed Flexible Active Multilayered Structures Charles Trudeau1, 2, Martin Bolduc2, Patrick Beaupré2, Patrice Topart2, Christine Alain2, Sylvain Cloutier1 1

Department of Electrical Engineering, École de Technologie Supérieur, 1100 Notre-Dame Ouest, Montréal, QC, Canada H3C 1K3 2 Institut National d’Optique, 2740 Einstein Street, Québec, QC, Canada G1P 4S4 ABSTRACT Active inkjet materials are invoked in the fabrication of optoelectronic devices. These types of multilayer assemblies contain a variety of commercially available ink formulations. It is envisioned that a dielectric SU-8 material can be used in a FET-like structure to form an interlayer between conductive silver and semi-conductive MWCNT-doped PEDOT:PSS ink layers. These printed structures may be fabricated onto a polyimide based flexible substrate, for instance. These structures are a starting point for offering valuable information on layer-on-layer printing interactions and interface problematics within a complete inkjet device fabrication. INTRODUCTION Inkjet printing is a promising technology for flexible multilayer active devices printing. When using harsh or expensive materials for devices fabrication, this selective additive process becomes very advantageous due to the reduced amount of wastage and is very ecofriendly when compared to alternative fabrication processes or even other printing processes. Inkjet printing also allows for the use of most materials for device substrates as long as they offer a non-porous printing surface and can withstand every post- and/or pre-printing processes which are performed during the device fabrication steps. Inkjet printing is a very mature technology, it is the advances in ink formulation that has made this process viable for device fabrication. A wide range of conductive, dielectric and more recently organic semiconducting inks have been made commercially available by various companies, these inks have made it possible to print simple multilayered active device architectures [1, 2]. Most multilayered device fabrication follow a similar layer by layer flow process. Starting with surface treatments of the printing substrate which can include underlying printed layers for printing subsequent layers. These treatments can take the form of hydrophilic-phobic surface treatments or surface cleaning processes for instance. In the following step, the layer is printed using previously optimized printing parameters to form a homogeneous layer of wanted characteristics. Once the layer is printed, post processes, such as annealing or layer activation, are performed to transform the ink in its final state [3, 4]. This flow process then repeats itself, for each subsequent layer until the device is fully printed. In this work, the effects of the printing parameters will be investigated, post- and pre-printing processes and their effects will be explored, and finally simple active multilayered device structures will be printed and investigated.

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