Insights into fundamental deformation processes from advanced in situ transmission electron microscopy
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Introduction Relating the macroscopic deformation behavior of a material to its microscopic defect processes is one of the key challenges of materials science. Transmission electron microscopy (TEM) has contributed continuously and extensively to this endeavor, starting with the investigation of crystal dislocations more than 60 years ago.1 Already in these early days, first in situ mechanical testing stages were developed to observe dislocations at work under applied load.2,3 Since then, a large variety of sample holders and devices for in situ nanomechanical testing inside the TEM have been explored, ranging from classical in situ straining stages to nanoindentation holders and microelectromechanical systemsbased actuators.4,5 Progress has also been made in the preparation of highly versatile samples for nanomechanical testing. In particular, modern focused ion beam (FIB) instruments enable site-specific preparation of samples with increased surface quality,6–9 which can be further improved by post-treatments.10,11 Finally, TEM and scanning transmission electron microscopy (STEM) technologies have seen major developments in recent years with regard to
resolution, stability, detection efficiency, and data processing, all of which are available for in situ mechanical testing studies. The development of in situ TEM/STEM nanomechanics has been documented in a number of review articles.4,12–14 Here, we describe further progress by presenting selected recent work in which advanced in situ TEM/STEM studies have provided direct insights into fundamental deformation and defect processes in different classes of materials, ranging from metallic nanostructures to nanotwinned biological materials, from well-defined ceramic bicrystals to ultimately thin twodimensional (2D) materials. Advanced in situ aspects range from atomic-resolution studies during mechanical straining, to highly controlled sample geometries and loading scenarios, to cyclic loading combined with environmental TEM, to micromechanical defect manipulation in low-voltage STEM.
Interplay of dislocation slip and surface diffusion In nano-sized materials, the significant occurence of surfaces and interfaces as well as short diffusion lengths dramatically
Erdmann Spiecker, Institute of Micro- and Nanostructure Research, and Center for Nanoanalysis and Electron Microscopy, Department of Materials Science and Engineering, Friedrich-AlexanderUniversität Erlangen-Nürnberg, Germany; [email protected] Sang Ho Oh, Department of Energy Science, Sungkyunkwan University, Republic of Korea; [email protected] Zhi-Wei Shan, Center for Advancing Materials Performance from the Nanoscale, and Hysitron Applied Research Center in China, State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, China; [email protected] Yuichi Ikuhara, Institute of Engineering Innovation, School of Engineering, The University of Tokyo, Japan; [email protected] Scott X. Mao, Department of Mechanical Engineering and Materials Science, University of
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