Kinetic study of low-temperature transient liquid phase joining of an aluminum-sic composite

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Kinetic Study of Low-Temperature Transient Liquid Phase Joining of an Aluminum-SiC Composite V. SABATHIER, G.R. EDWARDS, and C.E. CROSS The transient liquid phase (TLP) joining of an aluminum 6061-SIC composite using a gallium interface has been investigated. The observed kinetics of this process suggest that diffusion occurs along interphase and subgrain boundaries at low temperatures (