Kinetics of Densification and Grain Growth of Pure Tungsten During Spark Plasma Sintering
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TION
TUNGSTEN is an important refractory metal with a body-centered cubic structure with high density (19.25 g/cm3) and the second highest melting point (3695 K [3422 C]) among all the elements.[1] It is widely used in high-temperature applications such as heating coils, tube filaments, and engines nozzles. Its high density confers a good ability to absorb radiation that, combined with its excellent high temperature properties, makes it suitable for application in nuclear reactors. Tungsten has also high electrical conductivity and therefore is widely used in electronic applications such as electrodes, wires, and conductive coatings. Tungsten is traditionally sintered using conventional sintering routes, which require high sintering temperatures (>2273 K [2000 C]) and long dwell times (20 hours), which are usually not able to achieve full density and normally produce coarse grain microstructures.[2] In conventional sintering, the sintering temperature can be significantly lowered by adding small amounts (
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