Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
- PDF / 1,268,276 Bytes
- 8 Pages / 593.972 x 792 pts Page_size
- 60 Downloads / 155 Views
https://doi.org/10.1007/s11664-020-08393-3 Ó 2020 The Minerals, Metals & Materials Society
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin XUEMIN SUN,1 WEIYUAN YU,1,3 and YANHONG WANG2 1.—State Key Laboratory of Gansu Province, Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050, Gansu Province, People’s Republic of China. 2.—School of Civil Engineering, Lanzhou University of Technology, Lanzhou 730050, Gansu Province, People’s Republic of China. 3.—e-mail: [email protected]
With the development trend of high speed, light weight, continual miniaturization, and multifunctionality of microelectronic products, the size of solder joints continues to shrink. Therefore, higher requirements are being placed on soldering techniques. This study used the immersion method to investigate the dissolution kinetics of copper in liquid tin at temperatures in the range of 240–300°C with ultrasonic and current coupling. The amount of dissolution and the thickness of the interfacial intermetallic compound (IMC) layer were measured and the dissolution activation energy was calculated. Results showed that the composite fields of ultrasonic and current coupling accelerated copper dissolution in liquid tin and decreased the dissolution activation energy. The dissolution rate was 5–7 times higher compared to that without ultrasound and current, and was 2–3 times higher compared to that using only current. At a certain temperature, with the increase in immersion time, the thickness of the interface IMC layer demonstrated parabolic growth. The sound pressure caused by the ultrasound and the temperature gradient caused by current in the liquid tin were simulated by finite element modeling. The results show that the sound pressure distribution in liquid tin was uneven, and the temperature gradient inside the liquid tin increased with current. Key words: Copper, current, dissolution, soldering, tin, ultrasound
INTRODUCTION Materials processing methods have been changing with the development of materials. Furthermore, physical methods required to change the processing environment of materials and obtain the required structure and properties have gradually become a hot spot. Electric fields,1–3 magnetic fields,4,5 and composite fields6,7 have been widely used in welding, casting, smelting, and semi-solid forming processes. Ultrasonic methods are widely used in the field of soldering. This is because, compared with other types of soldering, they do not require flux, but use ultrasonic cavitation to break
(Received March 21, 2020; accepted August 1, 2020)
the oxide film on the surface of the matrix and promote the wetting of the matrix and solder.8,9 Because of these advantages, ultrasound-assisted soldering is often used in connecting dissimilar materials, ceramics, and composite materials.10–13 The compound field, which gives full play to the advantages of a single field and can compensate for their deficiencies, refers to the combination of tw
Data Loading...
