Manufacturable Polymeric Optical Waveguide based Bus Structures for Board Level Optical Interconnects
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Manufacturable Polymeric Optical Waveguide based Bus Structures for Board Level Optical Interconnects Xinyuan Dou1, Xiaolong Wang2, Xiaohui Lin1 and Ray T. Chen1*, IEEE Fellow 1 Department of Electrical and Computer Engineering, the University of Texas at Austin, Austin, TX, 78758, USA 2 Oregon State University, Corvallis, OR 97331,USA
Abstract: In this paper, we studied the optimization of preparation for polymeric optical waveguide based bus structures with embedded 45 degree micro-mirrors by metallic hard mold method. The 45ยบ facets on the metallic hard mold, which were used to create the 45 degree micro-mirrors, were studied by the atomic force microscopy (AFM). The surface roughness of the 45 degree facets was reduced from 70nm to be 2nm by a photopolymer coating step. High speed test on the waveguide shows the low loss and high Q-factor performance of the waveguide structures. A backplane bus with 10 Gbits/sec channel will be reported. Introduction: The everlasting demand for increasing bandwidth, driven by high-speed network communications, high-definition video sharing and many other applications, draws many research efforts devoted to the development of high speed data communication for carrier networks and enterprise applications [1]. Challenges on electrical copper interconnects at high frequency make optical interconnect technologies become a promising alternative to conventional electrical interconnects at different levels, for example rack-to-rack, board-to-board and board level chip-to-chip interconnects [2-11]. The reported board level optical interconnects between two optomodules achieved an aggregated 160 Gb/s bidirectional data rate through 32 polymer waveguides operating at 10Gb/s [3]. Highly flexible polymeric waveguide for optical interconnects also has advantages in the application of next generation technology mobile devices, such as personal laptops, digital cameras and foldable mobile phones [12]. These foldable mobile devices require not only high speed, error free data transmission, but also the highly flexible interconnect near the hinge area, where the waveguide faces out-of-plane bending frequently. The performance of polymeric waveguide under out-of-plane bending needs to be investigated in order to meet the high requirement of future mobile devices, such as smaller hinge structure and higher data transmission speed. Design and simulation of the 3-to-3 optical bus architecture We proposed a 3-to-3 optical bus architecture, which is shown in Figure 1. It consists of two parallel optical buses, with 50um width, which can transmit optical signals toward two opposite directions. Optical signals, either from laser diodes (LD) of the master unit or the slave units, will be transmitted bi-directionally through two connected unidirectional couplers. The detectors (D) of either the master unit or the slave units are capable of receiving optical signals from both directions also, benefited from the two unidirectional couplers connected to them. The two parallel optical buses in conjunction wit
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