Mechanical and dielectric properties at liquid nitrogen temperature of epoxy/AlN composites modified with different cont
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Mechanical and dielectric properties at liquid nitrogen temperature of epoxy/AlN composites modified with different contents of flexible amine Zhuhua Zhao1 · Xiaofeng Zou1 · Ju Wang1 · Xuan Yu1 · Feng Yang1 · Zhou Yu1 · Hong Zhang1 · Yong Zhao1,2 · Yong Zhang1 Received: 31 January 2020 / Accepted: 15 April 2020 © Springer Nature Switzerland AG 2020
Abstract Epoxy resin has been wide applied in aerospace, superconducting industries because of the high electrical insulation, excellent adhesive properties and great chemical resistance. In this paper, epoxy/AlN composites were prepared by changing the content of the flexible amine (D-230) and the diethyl toluene diamine (DETDA) from 0 to 100 wt%. The effects of different ratios of D-230 and DETDA were investigated on the mechanical and dielectric properties of epoxy/ AlN composites at liquid nitrogen temperature (77 K) and room temperature (RT). The properties of the samples were characterized by flourier transformed infrared (FTIR), scanning electron microscopy and broadband dielectric spectrometer. FTIR results showed that AlN particles were successfully modified by the silane coupling agent (KH-560). Tensile testing showed that the addition of flexible diamines generally improved the elongation at break at both RT and 77 K and the tensile strength at 77 K. The introduction of D-230 led to a lower dielectric constant at cryogenic temperature than that at RT. Keywords Epoxy/AlN composites · Mechanical property · Dielectric property · Cryogenic temperature
1 Introduction The development of superconducting cryogenic temperature technology has brought extensive application of composite materials at cryogenic temperature. In recent years, many resistant epoxy resins have been used as binders and impregnating materials for cryogenic temperature applications [1–3]. Therefore, the research on the performance of epoxy resin under ultra-low temperature is gradually attracting many attentions [4–8]. Figure 1 is the molecular formula of epoxy resin E-51, showing that epoxy resin molecules contain a large number of extremely active epoxy groups, ether bonds and hydroxyl groups [9]. They can produce chemical bond or adsorption
between molecules, and cross-link with curing agents, so epoxy resin has high bonding strength and good moisture resistance as adhesive. In recent years, polymer composites have been widely used in the field of electronic devices, including central processing units, high-integrated memory chips, batteries, displays and electronic packaging materials for their excellent adhesive properties, good electrical insulation behaviors, low cost, high electrical insulating characteristics, great chemical resistance [10–14]. However, epoxy resins also have disadvantages such as brittleness, low toughness, and poor impact resistance, which limit the wide application. Incorporating heat-conducting insulating inorganic particles into epoxy resins can improve the
* Yong Zhao, [email protected]; * Yong Zhang, [email protected] | 1Key Laboratory of Advanced T
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