Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding
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Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding Hong-Sub Joo1,2, Choong-Jae Lee1, Kyung Deuk Min1, Byeong-Uk Hwang1, and Seung-Boo Jung1,* 1
School of Advanced Materials Science & Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon 16419, Republic of Korea 2 Test & System Package, SAMSUNG Electronics, 158 Baebang-ro, Baebang-eup, Asan-si 32489, Republic of Korea
Received: 7 July 2020
ABSTRACT
Accepted: 3 November 2020
The mass reflow (MR) process is widely used in electronic packaging interconnection. However, the conventional MR process can cause thermal damage to components and requires a long process time. The laser-assisted bonding (LAB) process is considered as an alternative soldering process for overcoming these limitations due to its extremely fast process time and high thermal selectivity. The LAB process causes low thermal damage; hence, it can be used to fabricate flexible and stretchable applications. This study investigates the mechanical properties, microstructural variation, and intermetallic reaction between the SAC 305 solder and Cu electrodes. The mechanical properties are investigated using shear tests, while the microstructure is analyzed using scanning electron microscopy and X-ray scans. Furthermore, the reliability of the LAB- and MR-produced SAC 305 solders is assessed using a high-temperature storage test. As a result, the intermetallic compound layer is found to be considerably thinner, and the volume of voids in the solder matrix is lower in the LAB-produced solder than that in the MR-produced solder. The mechanical properties of the LAB-produced solders are enhanced by these microstructural advantages.
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Springer Science+Business
Media, LLC, part of Springer Nature 2020
1 Introduction The excellent performance of electronic packaging has led to the miniaturization of numerous components [1, 2]. The importance of interconnection components has increased due to such miniaturization trends because various problems, such as the electromigration phenomena, electrochemical behaviors,
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https://doi.org/10.1007/s10854-020-04819-0
warpage problems, and thermal emission issues, occur in these components [3–6]. Different types of interconnection techniques, including soldering, sintering bonding, and transient liquid phase bonding, have been investigated [7–9]. Soldering is considered as a representative interconnection process for providing mechanical, electrical, and thermal connection in electronic packaging. Sn–3.0Ag–0.5Cu (SAC 305)
J Mater Sci: Mater Electron
alloy systems have been optimized as solder alloys due to their excellent reliability in electronic packaging [10]. However, the soldering processes of SAC 305 have been predominantly performed using the mass reflow (MR) process, which requires a high process temperature and a long process time, because the melting temperature of SAC 305 is 217 °C, which can impair the polymers in devices. Studies h
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