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MECHANISM OF INTERMETALLIC PHASE FORMATION IN THIN LIQUIDSOLID DIFFUSION COUPLES

F. Bartels, T. Muschik and W. Gust Max-Planck-Institut ffir Metaliforschung, Seestr. 75, D-7000 Stuttgart 1,Germany ABSTRACT Thin interconnection layers entirely consisting of intermetallic phases have been produced by joining planar Cu substrates coated with thin films of Sn. The thin layers of intermetallic phases are produced at low temperatures (

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