New Advances in Molding and Printing Processes for Organic/Plastic Electronics Using Chemically Modified Stiff, Photocur
- PDF / 167,104 Bytes
- 9 Pages / 612 x 792 pts (letter) Page_size
- 22 Downloads / 192 Views
L9.6.1
New Advances in Molding and Printing Processes for Organic/Plastic Electronics Using Chemically Modified Stiff, Photocured Poly (dimethylsiloxane) (PDMS) Elastomers Designed for Nano-Resolution Soft Lithography Kyung M. Choi 1 and John A. Rogers 2 Bell Laboratories, Lucent Technologies, Murray Hill, New Jersey, 07974, U. S. A. Department of Materials Science and Engineering, University of Illinois at UrbanaChampaign, IL 61801, U. S. A.
ABSTRACT The development of new materials for organic/plastic electronics allows us to fabricate novel devices through unconventional approaches. The ‘soft lithography technique’ has been widely used in replicating and fabricating small features. This technique is a low cost alternative to photolithography by generating structures from masters to substrates, which employ ‘elastomeric materials’, such as highly stretchable silicon elastomer, polydimethylsiloxane (PDMS) to replicate or transfer the original features to a variety of substrates by molding and printing processes. Since the resolution of pattern transfer significantly relies on the performance of polydimethylsiloxane (PDMS) stamp materials, commercial PDMS materials have shown limitations in high fidelity pattern transfer due to their low physical toughness and high thermal expansion coefficients. For those reasons, pattern fabrications using conventional PDMS materials are unable to satisfy our set of diverse demands, especially in the area of nano-scale replication. To achieve high performance in molding and printing, here we introduce a new strategy, design and synthesis of a modified PDMS silicon elastomer that is a stiffer and photocurable element to achieve our specific task of nano-scale resolution soft lithography. We then demonstrated its unique capabilities for the case of nano-features (300 nm wide) with narrow and tall heights (600 nm height) of photoresist, which is one of the most challenging ‘nano-patterning’ tasks in advanced soft lithography, which is often limited in its use at the nano-scale with other commercially available elastomers.
INTRODUCTION Since current silicon-based technology has shown the limitation in its diverse applications to satisfy our multiple demands, recent interests in seeking new technologies has gotten great attention for plastic/organic electronics. Plastic/organic electronics is one of the most promising technologies, which attracted us to participate due to its low-cost, high performance, and easy processability [1,2]. Its wide applicability also encourages us to pursue this multidisciplinary type of technology.
L9.6.2
Plastic electronics employs a pattern fabrication technique, soft lithography, which is a low cost alternative to photolithography to transfer small features from masters to substrates using silicon elastomers as a stamp material. Soft lithography carries out the pattern transfer through the molding and printing process, which are the two representative techniques [3-6]. It uses highly stretchable silicon elastomers based on poly(dimethylsiloxane) PD
Data Loading...
