New Surface Functional Metal Powders for Anisotropic Conductive Film Materials in Electronic Package Application
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New Surface Functional Metal Powders for Anisotropic Conductive Film Materials in Electronic Package Application
Shu-Chen Huang, Hsun-Tien Li, Kai-Chi Chen, Tzong-Ming Lee Industrial Technology Research Institute, Materials Research Laboratories, Hsinchu, Taiwan
ABSTRACT
New metal powders containing organic thin film layer with multi-functional properties are prepared and used in the manufacturing of anisotropic conductive film (ACF) material for electronic package application. The organic thin film layer possesses both insulating property and thermo-compressed flowable property. The former insulating property ensures metal powder to have good insulation property at room temperature, and the latter thermo-compressed flowable property maintains the electric conductance of ACF material after high temperature compression process. Besides, the organic thin film layer also exhibited good steric hindrance to enhance the dispersion and anti-settling of metal powers in resin matrix. The functional organic groups on the surface thin film will also improve the interface adhesion between metal powder and resin matrix. Such metal powder with surface chemical modification is suitable for electronic material application, for example, anisotropic conductive film (ACF).
INTRODUCTION
Recent years LCD display panels become very important components for portable electronics such as notebook PC, mobile phones or PDAs. The demands for better resolution and color quality LCD panels drive an advanced LCM package technology because of finer pitch higher inputs/outputs I/Os to be interconnected. For LCD displays, the packaging process must be low cost, fine pitch assembly, manufacturing and reworkable. The key technology for this package is the interconnection using the anisotropic conductive film ACF . The use of ACF offers lots of advantages including reduced package thickness, lowered assembly temperatures, improved environmental compatibility, decreased equipment needs, higher production throughputs,…etc [1~3]. ACF materials are generally composed of an adhesive polymer matrix with conductive particles. The ACF connection exhibits conductivity in the direction of thickness and insulating properties in the planar direction. Such anisotropic electrical conductivity is achieved by controlling of the volume fraction of fine conductive particles that is well below the percolation threshold, with the particles typically ranging from 3 to 15µm in diameter. Therefore, the ACF needs to have a structure allowing no conduction between any adjacent fine conductive particles. However, it is difficult to achieve anisotropic electrical conductivity when pattern pitch becomes finer in advanced applications.
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Figure1. Comparison of ACF interconnection (a) ACF with treated metal powder. It shows that metal powders are in contact with the IC bumps where the organic layer with thermocompressed flowable property is broken upon thermo-compression. However, the metal powders not compressed by the bonding pads, lateral s
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