Novel Chemical Approach to Achieve Advanced Soft Lithography by Developing New Stiffer, Photocurable PDMS Stamp Material
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Novel Chemical Approach to Achieve Advanced Soft Lithography by Developing New Stiffer, Photocurable PDMS Stamp Materials Kyung M. Choi 1and John A. Rogers 2 1 2
Bell Laboratories, Lucent Technologies, Murray Hill, New Jersey, 07974, U. S. A. Department of Materials Science and Engineering, University of Illinois at UrbanaChampaign, IL 61801, U. S. A.
ABSTRACT Recent advances in microfabrication technology allow us to develop a number of novel devices with high performance. In microfabrication technology, a new development, ‘soft lithography’, is widely used by making stamps, molding, and microcontact-printing due to the low cost and easy processability. The resolution of soft lithography significantly relies on the performance of stamping materials. However, pattern transfers using commercially available PDMS stamp materials often end up with mechanical failures such as collapse or sag due to their low physical stiffness. Additionally, most of those commercial PDMS materials are thermally curable systems, which results in significant thermal deformations. These limitations have motivated us to start this work, which demonstrates a ‘chemical approach’ to overcome those limits by developing new stiff, photocurable PDMS stamp materials with attached designed functionalities. Molecular modification of PDMS materials results in advanced soft lithography, which produces enhanced physical toughness, lower polymerization shrinkage, and photopatterning capability.
INTRODUCTION Silicon-based compounds have been widely used in our lives for centuries. Their significant contributions to cutting-edge technologies can’t be disregarded, especially in the computer industry even after polymeric/organic materials turned up and substituted for silicon-based materials. Silicon-based compounds are still very useful due to their high thermal stability, their chemically inertness, and good mechanical properties compared to those of organic materials. In addition, there is a lot of potential to modify their structures to explore their unique applications, for example in the development of new organic/inorganic hybrid silicate materials with molecularly tailored functions in one molecule. In this work, we demonstrate an example of useful silicon elastomers, which brings us advances in micro-fabrication technology. Microfabrication is a widely used technology, which transfers small features from masks to diverse substrates to develop new devices [1-3]. In microfabrication research, UV photolithographic technique has been employed for pattern transfer tasks. However, the conventional photolithography is an expensive process, which needs high cost such as clean room facilities and expensive equipments.
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Recently, a new development, soft lithographic technology, has arrived and has been widely used in pattern replica. Soft lithography is an alternative of photolithographic process, which employs silicon elastomers based on poly(dimethyl)siloxane (PDMS) structure as a stamp material to replica structures from the original ma
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