Optical Waveguides Embedded in PCBs - A Real World Application of 3D Structures Written by TPA
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Optical Waveguides Embedded in PCBs - A Real World Application of 3D Structures Written by TPA Ruth Houbertz1, Herbert Wolter1, Volker Schmidt2, Ladislav Kuna2, Valentin Satzinger2, Christoph Wächter3, and Gregor Langer4 1 Hybrid Materials for Microsystems and Micromedicine, Fraunhofer ISC, Neunerplatz 2, Wuerzburg, 97082, Germany 2 Institute of Nanostructured Materials and Photonics NMP, Joanneum Research, Franz-PichlerStr. 30, Weiz, 8160, Austria 3 Microoptics, Fraunhofer IOF, Albert-Einstein-Str. 7, Jena, 07445, Germany 4 Austria Technologie & Systemtechnik, Fabriksgasse 13, Leoben, 8700, Austria Abstract The integration of optical interconnects in printed circuit boards (PCB) is a rapidly growing field worldwide due to a continuously increasing need for high-speed data transfer. There are many concepts discussed, among which are the integration of optical fibers or the generation of waveguides by UV lithography, embossing, or direct laser writing. The devices presented so far require many different materials and process steps, but particularly also highly-sophisticated assembly steps in order to couple the optoelectronic elements to the generated waveguides. In order to overcome these restrictions, an innovative approach is presented which allows the embedding of optoelectronic components and the generation of optical waveguides in only one optical material. This material is an inorganic-organic hybrid polymer, in which the waveguides are processed by two-photon absorption (TPA) processes, initiated by ultra-short laser pulses. In particular, due to this integration and the possibility of in situ positioning the optical waveguides with respect to the optoelectronic components by the TPA process, no complex packaging or assembly is necessary. Thus, the number of necessary processing steps is significantly reduced, which also contributes to the saving of resources such as energy or solvents. The material properties and the underlying processes will be discussed with respect to optical data transfer in PCBs. I. INTRODUCTION The tremendous increase in performance of microelectronic devices is also associated with optical data transfer at increasingly lower distance. The trend to miniaturized devices cannot be prevented anymore while, simultaneously, their complexity and functionality is continuously increasing. The high demand of bandwidth will push optical data connections further forward, where data transfer also will be included into printed circuit board (PCB) technology. Conventional copper technology faces some limitations, for example related to frequency-dependent signal propagation delay and increasing cross-talk upon further reducing the packaging density of electrical connections. However, these limitations in electrical circuitry can be overcome by complex and costly shielding procedures. In the past years, optical data transfer has revolutionized information and communication technologies. Integrated optical devices are the key components in current and future data transfer technologies, s
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