Physical Vapor Deposition (PVD)
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Physical Vapor Deposition (PVD) Konstantinos-Dionysios Bouzakis1 and Nikolaos Michailidis2,3 1 Laboratory for Machine Tools and Manufacturing Engineering and Fraunhofer Project Center Coatings in Manufacturing (PCCM)/Mechanical Engineering Department, School of Mechanical Engineering, Aristoteles University of Thessaloniki, Thessaloniki, Greece 2 Physical Metallurgy Laboratory and Fraunhofer Project Center Coatings in Manufacturing (PCCM)/Mechanical Engineering Department, School of Mechanical Engineering, Aristoteles University of Thessaloniki, Thessaloniki, Greece 3 Center for Research & Development on Advanced Materials – CERDAM, Thessaloniki, Greece
Synonyms
Theory and Application History The development of PVD techniques is directly linked to the evolution of vacuum, electronics, magnetism, and plasma technologies, as well as to the advances in gaseous chemistry. A combination of numerous related achievements and inventions was the prerequisite for the first industrial application of PVD. In the 1930s, cathode sputtering was employed for the fabrication of coatings (Fruth 1932), while sputtering by ion bombardment was reported for commercial application in the 1950s (Wehner 1955). Evaporation techniques like arcing were developing in parallel. Today, complicated techniques offer the potential to produce nanostructured, single- and multilayered coatings, with improved properties. Recent trends aim, among others, at reducing the production cost, enhancing process reliability, increasing the deposition rates, and alloying various elements for tailoring the film properties to application-specific needs.
Plasma-assisted coating in vacuum Theory
Definition
Introduction
Physical vapor deposition (PVD) is a vacuum process allowing material transfer in the form of vapor particles from a material source (target) to the substrate.
Physical vapor deposition (PVD) covers a broad family of vacuum coating processes in which the employed material is physically removed from a source or “target” by evaporation or sputtering. Then, it is transported by the energy of the vapor
# CIRP 2018 The International Academy for Production Engineering et al. (eds.), CIRP Encyclopedia of Production Engineering, https://doi.org/10.1007/978-3-642-35950-7_6489-5
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particles and condensed as a film on the surfaces of appropriately placed parts, under vacuum. Chemical compounds are deposited either by using a similar source material or by introducing reactive gases (nitrogen, oxygen, or simple hydrocarbons) containing the desired surfactants, thus reacting with metal(s) from the PVD target. Most of the PVD processes are known by various phrases or acronyms, and they are typically named for the means for producing the physical vapor. The major categories are evaporation and sputtering. Evaporation can be resistive, inductive, electron beam, activated reactive evaporation, or arc evaporation (DC or alternate current (AC)). Sputtering can be diode or triode, ion beam, or magnetron sputtering, i.e., direct current (DC), radio frequency (RF), p
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