Plasma Spray-CVD: A New Thermal Spray Process to Produce Thin Films from Liquid or Gaseous Precursors
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JTTEE5 20:882–887 DOI: 10.1007/s11666-011-9655-8 1059-9630/$19.00 Ó ASM International
Plasma Spray-CVD: A New Thermal Spray Process to Produce Thin Films from Liquid or Gaseous Precursors M. Gindrat, H.-M. Ho¨hle, K. von Niessen, Ph. Guittienne, D. Grange, and Ch. Hollenstein (Submitted December 14, 2010; in revised form March 22, 2011) New dedicated coating processes which are based on the well-known LPPSÔ technology but operating at lower work pressure (100 Pa) are being actively developed. These hybrid technologies contribute to improve the efficiencies in the turbine industry such as aero-engines and land-based gas turbines. They also have a great potential in the domain of new energy concepts in applications like Solid Oxide Fuel Cells, membranes, and photovoltaic with the adoption of new ways of producing coatings by thermal spray. Such processes include Plasma Spray-Thin Film (PS-TF) which gives the possibility to coat thin and dense layers from splats through a classical thermal spray approach but at high velocities (400-800 m/ s) and enthalpy (8000-15000 kJ/kg). Plasma Spray-PVD (PS-PVD) which allows producing thick columnar-structured Thermal Barrier Coatings (100-300 lm) from the vapor phase with the employment of the high enthalpy gun and specific powder feedstock material. On the other hand, the Plasma SprayCVD (PS-CVD) process uses modified conventional thermal spray components operated below 100 Pa which allows producing CVD-like coatings (
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