Properties of borosilicate glass/Al 2 O 3 composites with different Al 2 O 3 concentrations for LTCC applications
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Properties of borosilicate glass/Al2O3 composites with different Al2O3 concentrations for LTCC applications Xianfu Luo1,2 · Huajie Tao1,2 · Pengzhen Li1,2 · Yao Fu1,2 · Hongqing Zhou1,2 Received: 27 May 2020 / Accepted: 6 July 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract This article aims to investigate the effect of Al2O3 in borosilicate glass on the sintering densification and properties of the borosilicate glass/Al2O3 LTCC composites. A series of CaO–Al2O3–B2O3–SiO2 (CABS) glass with different concentrations of Al2O3 was synthesized, as well as the CABS glass/Al2O3 LTCC composites. The influence of A l2O3 on the sintering densification, phase composition, microstructures and properties of the CABS glass/Al2O3 LTCC composites was then systematically investigated. Result indicates that a proper amount of A l2O3 in CABS glass not only can strengthen the structural stability of the borosilicate glass, but also can promote the sintering densification and improve the properties of the glass/ ceramic composites. CABS glass/Al2O3 composites prepared with CABS glass of 4 wt.% Al2O3 sintered at 875 °C exhibits excellent properties of a sintering density of 3.13 g/cm3, a Z axial shrinkage of 15.5%, a dielectric constant (εr) of 8.08, a dielectric loss (tanδ) of 0.9 × 10–3 (at 7 GHz), a coefficient of thermal expansion (CTE) of 5.35 ppm/°C, a flexural strength of 206 MPa, demonstrating its great potential for LTCC applications.
1 Introduction With the demand for miniaturization and integration of electronic components, increasingly significance has been attached to microelectronic packaging technology in the wireless communication industry [1–3]. Low temperature co-fired ceramic (LTCC), which integrates the interconnected conductors, passive components, and packaging technology on a multi-layer ceramic substrate, has emerged as one of the most promising candidates for microelectronic packaging [4]. LTCC materials, as the core of LTCC technology, have claimed widespread attention over the past decades, owing to their viable merits, for instance, the intrinsically low sintering temperature (≤ 1000 °C), being capable of co-firing with internal electrodes made of highconductivity metals (Au, Ag and Cu, etc.), and the outstanding mechanical, thermal, and microwave dielectric properties [5, 6]. LTCC materials are widely utilized to fabricate * Hongqing Zhou [email protected] 1
College of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, China
Jiangsu Collaborative Innovation Center for Advanced Inorganic Function Composites, Nanjing Tech University, Nanjing 210009, China
2
multichip-integrated circuits and modules in the wireless communication, computer hardware, and automotive electronics industries, demonstrating broad application prospects [7]. The low sintering temperature of the LTCC materials is achieved by generating a large amount of liquid phase during the sintering process. According to their composition, the LTCC materials can be d
