Pulse Reverse Electrodeposition of Cu-SiC Nanocomposite Coating: Effects of Surfactants and Deposition Parameters
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TRODUCTION
SURFACE is the most important part of many materials in specific applications. It decides not only the performance but also the useful service life of the material. For this reason, surface property improvement has always been remained as an important research topic. Copper is the most widely used metal for electrical, electronic, and thermal conduction applications because of its excellent electrical and thermal conductivity. It costs only a fraction in comparison to the most electrically and thermally conducting metal silver, whereas it exhibits almost similar properties. In comparison to the third most electrically and thermally conducting metal aluminum, its cost is justifiable considering its properties. However, it possesses several weaknesses, e.g., it is soft and possesses low strength, low corrosion resistance under aggressive environment, high coefficient of friction, etc. These limitations restrict the applications of copper at several places like electrical contact application in corrosive environments, structural applications, high temperature, and high strength thermal conduction applications. Thus, in order to expand the field of application, in-service performance, and total service life, the above mentioned weaknesses of copper need to be improved. These improvements can be achieved by several ways like thermomechanical treatment, alloying, composite formation, etc. Out of these, composite formation is one of the most promising AJAYA KUMAR PRADHAN, Research Scholar, and SIDDHARTHA DAS, Professor, are with the Department of Metallurgical Engineering, Indian Institute of Technology (IIT) Kharagpur, Kharagpur, 721302 West Bengal, India. Contact e-mail: [email protected] Manuscript submitted July 3, 2013. Article published online August 15, 2014 5708—VOLUME 45A, NOVEMBER 2014
methods to control the properties of copper by incorporating a suitable second phase material in it. Also, there are several processes by which a composite can be formed like powder metallurgy, melting and casting, electrodeposition, etc. These processes have their own advantages, disadvantages, and application fields. From the view point of surface property modification and control, the electrodeposition is believed to be the most suitable one. Formation of nanocomposite has been reported to improve many properties of a metal significantly.[1–7] However, formation of nanocomposite by the codeposition of SiC nanoparticles from an aqueous solution has been reported to be difficult.[1–4] Aqueous electrolytes are of particular technological interest as they are environment friendly and economic. Lekka has reported that SiC particles get negative charge inside an aqueous solution at lower pH.[1] Hence, there codeposition from aqueous solution becomes difficult at the cathode. Zanella et al.[3] have observed only 0.9 wt pct SiC nanoparticle codeposition into the nickel matrix from an aqueous solution containing 20 g/L SiC nanoparticle. Similarly, Zhu et al.[4] have reported only 2 wt pct incorporation of SiC nanoparticle into t
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