Pure copper layer formation on pure copper substrate using multi-beam laser cladding system with blue diode lasers
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Pure copper layer formation on pure copper substrate using multi‑beam laser cladding system with blue diode lasers Takahiro Hara1 · Yuji Sato2 · Ritsuko Higashino2 · Yoshinori Funada3 · Tomomasa Ohkubo4 · Kento Morimoto1 · Nobuyuki Abe2 · Masahiro Tsukamoto2 Received: 15 October 2019 / Accepted: 16 April 2020 © Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract In electrical and mechanical industries, forming a pure copper layer on various substrates would improve the performance of automotive motors, batteries, etc. However, the formation of a pure copper layer has yet to be reported on a pure copper substrate. Here, a pure copper layer is formed on a pure copper substrate (C10200) using a multi-beam laser cladding system with blue diode lasers. The powder mass efficiency increases with the laser intensity. These results are used to construct a powder temperature model. At a laser intensity of 6.5 × 104 W∕cm2 , 9.65% of the powder forms a copper layer. In the supplied powder, approximately 5% of the powder is melted on the fly. In addition, about 5% of the powder is melted after trapping on the substrate. Hence, melting powder on the fly and melting the trapped powder on the substrate form the copper layer. Keywords Blue diode laser · Laser cladding · Multi-beam laser cladding · Pure copper · Powder temperature
1 Introduction Pure copper has high thermal and electrical conductivities [1]. Forming a pure copper layer improves the performances of the electrical and mechanical components [2–4]. Common methods to form a material layer on the target substrate include thermal spraying, arc welding, and plasma transferred arc welding. However, they have some problems. Thermal spraying is suitable for rapid processing, but the adhesive strength is weak because it is mechanically joined by the anchor effect. Although arc welding and plasma transferred arc welding have good adhesive strength between the substrate and the layer, the excessive heat input results in a large dilution [5–7]. Therefore, we focus on the laser * Takahiro Hara [email protected]‑u.ac.jp 1
Graduate School of Engineering, Osaka University, 1‑1 Yamadaoka, Suita, Osaka 565‑0871, Japan
2
Joining and Welding Research Institute, Osaka University, 11‑1 Mihogaoka, Ibaraki, Osaka 567‑0047, Japan
3
Industrial Research Institute of Ishikawa, 2‑1 Kuratsuki, Kanazawa, Ishikawa 920‑8203, Japan
4
Department of Mechanical Engineering, Tokyo University of Technology, 1404‑1 Katakuramachi, Hachioji, Tokyo 192‑0982, Japan
cladding method using a powder. It produces cladding layers on the substrate by melting a powder material via laser irradiation to form a dense and highly pure layer. Hammati et al. [8] reported dilution in the laser cladding process and showed that the hardness of the layer decreases as the dilution ratio increases. Because dilution is a serious problem even in laser cladding, many studies have investigated it. In the conventional method, the laser is irradiated perp
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