Research Progress of Thermal Contact Resistance
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Research Progress of Thermal Contact Resistance Xiaoshan Pan1,2 · Xiaoyu Cui1 · Shaoshuai Liu2 · Zhenhua Jiang2 · Yinong Wu2 · Zhichao Chen1,2 Received: 9 April 2020 / Accepted: 2 July 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract Thermal contact resistance of solid–solid interface is involved in many fields such as aerospace, low-temperature superconductivity and electronic machinery. With the booming of aerospace technology, the requirements for space detectors continue to increase; the research on accurate prediction, measurement and utilization of thermal contact resistance is becoming increasingly serious. This article systematically summarizes and analyzes the research progress of thermal contact resistance. It also comparatively analyzes theoretical prediction models, steady-state and transient-state experimental methods and numerical analysis methods from different angles, and summarizes the advantages and disadvantages of different methods. Moreover, the effects of the influencing factors such as the physical properties, the surface state, the contact pressure, the contact temperature, the heat flux direction and the thermal interface materials on the solid–solid thermal contact resistance are also briefly described. Through this systematic comparative analysis, further development directions are pointed out. Keywords Thermal contact resistance · Thermal contact conductivity · Theoretical model · Experimental research · Applications List of Symbols a Radius of actual contact spot (m) b Radius of adnominal contact spot (m) c Specific heat capacity [J/(kg K)] d Mean plane separation (m) D Thickness of specimen (m) E′ Equivalent elastic modulus (Pa) * Shaoshuai Liu [email protected]; [email protected] 1
School of Energy and Power Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
2
Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
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Vol.:(0123456789)
Journal of Low Temperature Physics
f Modulation frequency (Hz) F External force (N) H Bulk hardness (Pa) Hmic Microhardness (Pa) k Thermal conductivity [W/(m K)] L Displacement m Effective mean absolute surface slope ns Number of microcontacts r Radius of curvature (m) Q Heat flux (W) RL Macroscopic contraction resistance (m2 K/W) RS Microscopic contraction resistance (m2 K/W) Ra Arithmetic mean roughness T Temperature (K) Y Mean surface plane separation (m) z Mean plane separation (m) Greek Symbols α Thermal diffusivity (m2/s) β Summits radii of curvature (m) γ Plasticity index δ Height of rough peak (m) θ Angle of the surface asperities (rad) λ Dimensionless surface mean plane separation (λ=Y/σ) ρ Density (kg/m3) σ RMS surface roughness heights (m) σ′ Surface roughness (m) φ The phase lag (rad)
Fig. 1 Heat transfer diagram of actual solid contact interface [25, 26]
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Journal of Low Temperature Physics
ψ Effect factor of thermal contact resistance Φ Diameter of sample , m
1 Intr
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