Signal Propagation and Multiplexing Challenges in Electronic Textiles
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Signal Propagation and Multiplexing Challenges in Electronic Textiles J.F. Muth, E. Grant, K.A. Luthy, L.S. Mattos, J.C. Braly ECE Department, North Carolina State University, Raleigh NC 27695 A. Dhawan, A.M. Seyam, T.K. Ghosh. Textile Apparel Technology and Management, N.C. State University, Raleigh NC, 27695 ABSTRACT Weaving, knitting or placing electronic circuits within a textile matrix offer exciting possibilities for large-scale conformal circuits where the circuit dimensions can be measured on the scale of yards instead of inches. However, compared with conventional printed circuit board circuits, the textile manufacturing process and the electrical/mechanical properties of the fibers used in making the textile place unusual constraints on the electrical performance of textile circuits. In the case of distributed sensors connected via an electronic fabric, signal attenuation and the ability to form reliable interconnections are major challenges. To explore these challenges we have woven and knitted a variety of electrical transmission lines and optical fibers in fabrics to analyze their performance. The formation of interconnects and disconnects between conductors woven in textiles is also discussed, and a passive acoustic array is described as a possible electronic textile application. INTRODUCTION At this early stage in development there is no official definition of electronic textiles, rather the designation of “Electronic Textiles” or “E-textiles” can probably be thought of as the potential area of intersection between two large industries Textiles and Electronics. The two industries are roughly comparable in size, ~ 480 B/year for textiles and ~450 B/year for traditional electronics. Modern textiles products are typically thought of as flexible, conformal materials produced in low cost, continuous processes at high rates. Electronics are typically envisioned as integrated circuits with an incredibly large number of very small transistors incorporated into chips inserted into rigid circuit boards. Electronics are typically produced in expensive fabrication facilities with precision batch processes that are limited to ~ 12 inch diameter wafers for silicon, and ~24 x 24 inch circuit boards. The low cost of both electronics and textiles are typically derived from economies of scale.
FIGURE 1.
Intersection of Electronics and Textiles Industries
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FIGURE 2. Size scale of electronics from left to right, nm transistor gate, µm metal interconnect line widths, mm wire bonds, cm chip carrier and circuit board, m and km local area networks.
The convergence of electronics and textiles technologies has the potential to combine the positive attributes of each technology, the speed and computational capacity of modern electronics, with the flexible, conformal, continuous nature of textiles. Textiles processes may also provide an economical way to distribute sensors, and computation over large areas. Potentially this convergence could lead to the mass production of commercial products in an economical
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