Significant effect of orientation on Cu 6 Sn 5 coarsening behavior in isothermal aging process
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Significant effect of orientation on Cu6Sn5 coarsening behavior in isothermal aging process Chong Dong1, Haoran Ma2,* , MuhammadMuzammal Hussain1, Liying Sun1, Jun Chen1, Yunpeng Wang1, Xiaogan Li1, and Haitao Ma1,* 1 2
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China School of Microelectronics, Dalian University of Technology, Dalian 116024, China
Received: 10 July 2020
ABSTRACT
Accepted: 9 October 2020
Intermetallic compound (IMC) formed on (001) and (111) Cu single crystal has strong orientation and texture characteristics. The special interface morphology and uniform orientation provide a direction for the regulation of IMC growth behavior. In this study, the significant effect of orientation on Cu6Sn5 growth behavior in isothermal aging process was investigated. Synchrotron radiation technology and high pressure air blowing methods were employed to obtain the growth kinetics and the morphology of Cu6Sn5 during the heat preservation stage. The results indicate that scallop-like Cu6Sn5 grains were formed in heat preservation stage. These grains exhibited an abnormal coarsening behavior that their average diameter at a high temperature of 300 °C was smaller than that at a low temperature of 250 °C after aging for 30 min. Besides, the growth orientation and kinetic controlling factor of these interfacial Cu6Sn5 also changed with the increase of reaction time, which was closely related to the appearance of the abnormal coarsening phenomenon. These results are significant and meaningful to the electronic packaging industry.
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Springer Science+Business
Media, LLC, part of Springer Nature 2020
1 Introduction With the concern about the environmental problem and human health, Pb-free solder, Sn-3.0Ag, have been widely utilized in electronic industry [1, 2]. During soldering, Intermetallic compound (IMC) will form on the interface and the reliability of solder joints is greatly affected by the thickness, morphology and distribution of IMCs [3]. Therefore, it is necessary to have a deep understanding of its growth behavior.
With the development of 3D packaging technology, the diameter of solder bumps is downsizing a scale of several microns and the under bump metallization (UBM) can contain only several grains [4, 5]. For this condition, the coarsening behavior of IMC is greatly influenced by the crystal orientation. Since the anisotropic growth of Cu6Sn5, not only the electronic and mechanical properties but also the morphology and coarsening behaviors are affected by the grain orientation. For instance, the roof-like Cu6Sn5 formed on (001) and (111) Cu single crystals has strong
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https://doi.org/10.1007/s10854-020-04646-3
J Mater Sci: Mater Electron
orientation and texture characteristics, which is not observed at the polycrystalline copper interface [6, 7]. There was a 20% increase in strength and a 7% increase in Young’s modulus [8, 9]. Moreover, Song plane had a higher et al. [10] foun
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