Size-controlled Preparation of Alkylamine-stabilized Copper Fine Particles from Cupric Oxide (CuO) Micro-particles
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MRS Advances © 2019 Materials Research Society DOI: 10.1557/adv.2019.91
Size-controlled Preparation of Alkylamine-stabilized Copper Fine Particles from Cupric Oxide (CuO) Micro-particles Tetsu Yonezawa,* Jiajia Shi, Hiroki Tsukamoto, and Mai Thanh Nguyen Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University, Kita 13 Nishi 8, Kita-ku, Sapporo, Hokkaido 060-8628
ABSTRACT
Size control of copper fine particles is highly important for their application for conductive materials. In this study, easy size tuning of the copper fine particles coated by n-hexylamine was achieved via controlling the ratio of n-hexylamine and the precursor CuO. The obtained particles were stable and had a hydrophobic surface. TG-DTA measurement revealed the formation of thin layer of n-hexylamine on the particles.
INTRODUCTION Particle technology is rapidly developing and its products are extremely useful in various fields [1-5]. Powders, micron particles, fine particles, and nanoparticles are classified by their sizes, and all kinds of particles have a high potential for electronic, magnetic, as well as optical applications. Among these particle materials, much work on copper and silver fine particles and nanoparticles has been done in order to develop welldispersed uniform and size controlled ones for the applications for materials for electronics [6-8]. According to the high electro and thermal conductivity of these two elements, their fine particles and nanoparticles are highly demanded for printed electronics [9,10]. Printed electronics is suitable for modern industry which requires small-volume production with large varieties and rapid remodeling. Copper can be the more promising candidate as a wiring and bonding material for printed electronics because of their lower price, lower possibility of ion migration than silver and of the similar conductivity as silver. However, comparing to silver particles, production of copper fine particles and nanoparticles are rather complicated because the obtained particles are ready to be oxidized. Recently, our group reported anti-oxidative copper
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fine particles and nanoparticles using polymers as the anti-oxidative coating on the surface [6,7]. In order to apply copper fine particles as materials for printed electronics, it is highly demanded that the uniform copper fine particles can be obtained by an easy preparation process [6,7,11]. Moreover, precise tuning of the particle sizes is also required. Various preparation parameters should be controlled for this purpose. Reducing reagent, temperature, precursors, and stabilizing reagents, are important factors for tuning the particle size. In our previous study, the molecular weight of gelatin is effective to tune the sizes of the copper fine particles [7]. The quantity of
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