Solder Joint Reliability Assessment Finite Element Simulation Method
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to relia
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Mohd N. Tamin Norhashimah M. Shaffiar
Solder Joint Reliability Assessment Finite Element Simulation Methodology
Advanced Structured Materials Volume 37
Series editors Andreas Oechsner, Southport, Australia Lucas F. M. da Silva, Porto, Portugal Holm Altenbach, Magdeburg, Germany
For further volumes: http://www.springer.com/series/8611
Mohd N. Tamin · Norhashimah M. Shaffiar
Solder Joint Reliability Assessment Finite Element Simulation Methodology
13
Mohd N. Tamin Faculty of Mechanical Engineering Universiti Teknologi Malaysia Skudai, Johor Malaysia
Norhashimah M. Shaffiar Department of Manufacturing and Materials Kulliyyah of Engineering International Islamic University Malaysia Gombak, Kuala Lumpur Malaysia
ISSN 1869-8433 ISSN 1869-8441 (electronic) ISBN 978-3-319-00091-6 ISBN 978-3-319-00092-3 (eBook) DOI 10.1007/978-3-319-00092-3 Springer Cham Heidelberg New York Dordrecht London Library of Congress Control Number: 2014936614 © Springer International Publishing Switzerland 2014 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. Exempted from this legal reservation are brief excerpts in connection with reviews or scholarly analysis or material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. Duplication of this publication or parts thereof is permitted only under the provisions of the Copyright Law of the Publisher’s location, in its current version, and permission for use must always be obtained from Springer. Permissions for use may be obtained through RightsLink at the Copyright Clearance Center. Violations are liable to prosecution under the respective Copyright Law. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. While the advice and information in this book are believed to be true and accurate at the date of publication, neither the authors nor the editors nor the publisher can accept any legal responsibility for any errors or omissions that may be made. The publisher makes no warranty, express or implied, with respect to the material contained herein. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Preface
This book addresses various aspects of solder joints’ reliability assessment for microelectronic assembly with Ball Grid Array (BGA) solder joints. Computational aspects of the reliability assessment are deliberated
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