Stress relaxation properties of an epoxy-based shape-memory polymer considering temperature influence: experimental inve

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Stress relaxation properties of an epoxy-based shape-memory polymer considering temperature influence: experimental investigation and constitutive modeling Pengxuan Fan1 · Wujun Chen1 · Jianhui Hu1 · Bing Zhao1 · Jifeng Gao1 · Guangqiang Fang2 · Fujun Peng2 Received: 15 January 2019 / Accepted: 20 June 2019 © Springer Nature B.V. 2019

Abstract Epoxy-based shape-memory polymer (ESMP), belonging to viscoelastic thermosets, exhibits strong temperature-dependent relaxation property caused by the glass transition process. Thoroughly experimental investigation and accurate numerical prediction are indispensable to be performed in the structures that demand for high precise structural controls. In this work, key parameters of an ESMP in stress relaxation process including initial modulus, elastic modulus, viscous modulus and relaxation time were experimentally investigated and constitutive-model-based analyzed to study the influence of the temperature, where the constitutive model was established by modifying the constant parameters of a neo-Hookean hyper-viscoelastic model to be functions of the temperature. A numerical simulation method was developed by coding UMAT in ABAQUS using the constitutive model and was verified by finite element simulations of stress relaxation experiments. The maximum deviation of 4.5% between simulations and experiments indicated the reasonability of the model in depicting stress relaxation process considering the influence of the temperature. Keywords Epoxy-based shape-memory polymer · Stress relaxation · Temperature dependence · Viscoelasticity transition · Thermal-viscoelastic constitutive model

1 Introduction Shape-memory polymers (SMPs) with shape storage and recovery abilities are drawing more and more interests in the recent researches of smart materials (Lin et al. 2018; Hanzon et al. 2018). Among them, epoxy-shape-memory polymer (ESMP) with high shape fixity and recovery is one kind of the most widely used materials due to the superior performance in thermal stability, chemical stability, machinability and low economic cost (Belmonte et

B W. Chen

[email protected]

1

Space Structures Research Center, Shanghai Jiao Tong University, Shanghai 200240, China

2

Aerospace System Engineering Shanghai, Shanghai 201108, China

Mech Time-Depend Mater

al. 2017a, 2017b; Altuna et al. 2016). The extensive researches of ESMP in 4D printing (Monzón et al. 2017; Fan et al. 2018), actuators (Belmonte et al. 2017a, 2017b; Wang et al. 2016), morphing structures (Gong et al. 2017; Len et al. 2015), shape-memory composites (Chen et al. 2015; Beblo et al. 2015; Wang et al. 2014) and medical devices (Zainal et al. 2017; Santhosh Kumar et al. 2013) declare that ESMP is a popular shape-memory material. In this case, detailed investigations of ESMP on the material synthesis (Ji et al. 2017; Zheng et al. 2015), thermal-viscoelastic behaviors (Fan et al. 2016; Hu et al. 2012; Lewis and Dell 2016), mechanical property and its improvement (Shi et al. 2017; Beblo et al. 2015; Santiago et al. 2016; Shi et al.